Chiplet技术研究与展望  

Research and prospect on Chiplet technology

作　　者：蒋剑飞[1] 王琴[1] 贺光辉[1] 毛志刚[1] JIANG Jianfei;WANG Qin;HE Guanghui;MAO Zhigang(Shanghai Jiao Tong University,Shanghai 200240,China)

机构地区：[1]上海交通大学微电子学院,上海200240

出　　处：《微电子学与计算机》2022年第1期1-6,共6页Microelectronics & Computer

基　　金：国家重点研发计划2019YFB2204500。

摘　　要：近年来,摩尔定律的脚步放缓,先进工艺下的芯片制造成本越来越高,如何在合理成本控制下,保持原来的发展步伐成为半导体产业面临的重要问题,Chiplet技术作为一种可以延续摩尔定律的解决方案受到行业重视,但其广泛使用还存在诸多的问题.本文从Chiplet技术的集成、互连和设计流程等角度分析其特点和面临的挑战.首先,比较当前不同类型基板上Chiplet技术的主要性能和成本特点,展望未来可能的集成方案.其次,基于并行和串行互连原理,对比当前主要Chiplet互连方案的参数与性能,提出面向Chiplet之间高速低功耗互连的可能方法.最后,提出了改进Chiplet设计流程的必要性和可能性.以上研究表明Chiplet技术需要基于成本考虑选择合适的集成工艺方案,并根据集成工艺来探索高速低功耗互连方法,也迫切需要制定互连标准来推动该技术的普及应用,Chiplet技术的设计流程中也需要引入新的工具和设计方法.In recent years,the pace of Moore's Law has slowed down,and the cost of chip manufacturing under advanced technology has become higherand higher.How to maintain the original pace of developmentunder reasonable cost control has become an important issue facing the semiconductor industry.Chiplet technology is valuedby the industry as a solution that can continue Moore's Law,but there are still many problems with its widespread use.The characteristics and challenges of Chiplet technology are analyzed from the perspective of integration,interconnection,and design process.First,the performance and cost of the Chiplet integration on different types of substrates are compared,and the possible Chiplet integration solutions are looked forward to.Secondly,based on the principles of parallel and serial interconnection,a possible method for high-speed and low-power interconnection between Chiplets is proposedby comparing the parameters and performance of the current main Chiplet interconnection schemes.Finally,the necessity and possibility of improving the design flow are analyzed.The above research shows that Chiplet technology needs to choose a suitable integration process based on cost considerations,and explore high-speed and low-power interconnect methods based on the integration process.It is also urgent to establish interconnection standards to promote the popularization and application of Chiplet technology,and new tools and design methods need to be introduced intothe design process of Chiplet technology.

关 键 词：芯粒 集成技术 互连 设计流程 

分 类 号：TN402[电子电信—微电子学与固体电子学]