先进电子封装中焊点可靠性的研究进展  

Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging

作　　者：高丽茵 李财富 刘志权 孙蓉[1] GAO Liyin;LI Caifu;LIU Zhiquan;SUN Rong(Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055;School of Materials,Sun Yat-sen University,Shenzhen 518107;Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016)

机构地区：[1]中国科学院深圳先进技术研究院深圳先进电子材料国际创新研究院,深圳518055 [2]中山大学材料学院,深圳518107 [3]中国科学院金属研究所,沈阳110016

出　　处：《机械工程学报》2022年第2期185-202,共18页Journal of Mechanical Engineering

基　　金：国家科技重大专项02专项(2011ZX02602);国家重点基础研究发展计划(973计划,2010CB631006)资助项目。

摘　　要：在先进封装中器件小型化的趋势下,焊点所处的服役环境越加苛刻,这对焊点材料提出了更高的可靠性要求。为保证微小尺寸焊点的可靠性,具有较强扩散阻挡能力的铁镍、铁镍磷和镍钴磷等合金作为新型凸点下金属层(Under bump metallization,UBM)应用。同时,微量元素对焊料合金力学性能、润湿性及界面化合物生长的调节作用也被广泛研究,以指导新型焊料的制备。与此同时,可靠性分析技术发展迅速。高精度的三维X射线显微镜(Three dimensional X-ray microscopy,3D-XRM)和超声波扫描显微镜(Scanning acoustic microscopy,SAM)等先进无损分析技术在界面表征、缺陷快速定位上的得到广泛应用;透射电镜(Transmission electron microscopy,TEM)、电子探针(Electron probe micro-analysis,EPMA)和背散射电子衍射(Electron back-scattered diffraction,EBSD)等前沿技术填补了纳米尺度表征以及未知物相鉴定等技术空白。随着可靠性分析能力的提高,材料在高温、温度循环、机械应力、电流等常见的单场应力下的失效行为和机理研究日趋成熟。由于多物理场耦合的形式更接近小尺寸焊点实际的工作应力状态,其失效行为机理以及寿命模型逐渐成为研究热点。Under the trend of miniaturization of microelectronic devices,the serving environment of solder joints becomes severer,which requires a higher reliability of materials.To ensure the reliability of micro-size solder joint,materials including Fe-Ni,Fe-Ni-P,and Ni-Co-P alloy which have strong diffusion barrier ability are introduced as novel under bump metallizations(UBMs).On the other hand,the effect of minor element on mechanical properties,wettability and interfacial IMC growth of solder material are widely researched in order to develop novel solder materials.At the same time,the analytical techniques for reliability research develop rapidly.Non-destructive techniques like three dimensional X-ray microscopy(3D-XRM)and Scanning acoustic microscopy(SAM)are widely used to characterize interface and locate the failures.Transmission electron microscopy(TEM),electron probe micro-analysis(EPMA)and electron back-scattered diffraction(EBSD)technology are used in the nano-scale characterization and phase identification.With the development of analytical ability,the failure behaviour and lifetime model under single field of high temperature,thermal cycling,mechanical stress and current are studied thoroughly.Further,since the condition of multi-field is more close to the real working condition,the failure behaviour and failure mechanisms of multi-field reliability are highly concerned.

关 键 词：先进封装 焊点 可靠性 寿命评估 

分 类 号：TG156[金属学及工艺—热处理]