提高金属膜基界面附着力的超声辅助电位活化机理与方法  

A new ultrasonic assisted electrochemical potential activation method to enhance the adhesion srength between electroforming layer and Cu substrate

作　　者：赵忠 朱鹏程[1] 李会芳 王韬 ZHAO Zhong;ZHU Pengcheng;LI Huifang;WANG Tao(School of Mechanical Engineering,Jiangsu University of Science and Technology,Zhenjiang 212100,China;Huzhou Yueqiu Motor Co.Ltd.,Huzhou 313009,China)

机构地区：[1]江苏科技大学机械工程学院,镇江212100 [2]湖州越球电机有限公司,湖州313009

出　　处：《江苏科技大学学报（自然科学版）》2022年第1期54-58,104,共6页Journal of Jiangsu University of Science and Technology:Natural Science Edition

基　　金：江苏省自然科学青年基金资助项目(BK20170583);中国博士后科学基金资助项目(2019M661736);江苏科技大学自制实验教学仪器设备项目(180813102002)。

摘　　要：在微机电领域,采用微电铸技术制作的金属微器件在生物、医药和光学等方面发挥着重要作用.然而,由于基底钝化层、金属微器件存在界面附着力差的问题,已成为制约微电铸技术发展的瓶颈.为了提高界面附着力,提出一种超声辅助电位活化改善界面附着力新方法.根据电位活化理论和超声空化理论,分析超声辅助电位活化电化学反应过程,研究超声辅助电位活化机理,采用计时电位方法分析超声对电位活化反应过程的影响,利用EDS测量金属膜基界面氧元素含量,采用划痕法测量金属膜基界面附着力.给出了超声去除基底表面钝化层的实验依据,分析了超声参数对界面附着力影响规律.结果表明:在电铸初期施加超声能够促进析氢反应,有效去除基底表面钝化层,提高界面附着力.In MEMS area,micro metal device fabricating by the micro electroforming process was used widely in biology,medicine and optics area.However,due to the oxide layer of the substrate surface,the electroforming layer suffers from the poor adhesion strength.In order to reduce the oxide layer of the substrate surface,effects of the new ultrasonic electrochemical potential activation method to improve the adhesion strength are investigated originally.The chronopotentiometric method was processed by an electrochemical station.The oxygen content of the substrate surface was measured by the EDS method.The adhesion strength between the electroforming Ni layer and the Cu substrate was measured by the scratch test.The experimental results show that,compared with the ultrasound free one,the ultrasonic electrochemical potential activation method can improve the hydrogen evolution reaction and reduce the Cu substrate surface oxide content.The results can provide a new ultrasonic electrochemical potential activation method to activate the oxide layer of the substrate surface and to improve the interfacial adhesion performance.

关 键 词：微电铸 超声 电位活化 界面附着力 钝化层 

分 类 号：TH16[机械工程—机械制造及自动化] TQ153.4[化学工程—电化学工业]