焊接参数对Au80Sn20焊料封装孔洞和微观组织的影响  

Effect of Soldering Parameters on Pores and Microstructure of Au80Sn20 Solder Package

作　　者：颜炎洪 徐衡 王英华 陈旭 李守委 刘立恩 YAN Yanhong;XU Heng;WANG Yinghua;CHEN Xu;LI Shouwei;LIU Li′en(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China;Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)

机构地区：[1]中科芯集成电路有限公司,江苏无锡214072 [2]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2022年第4期27-32,共6页Electronics & Packaging

摘　　要：气密性封装工艺广泛应用于高可靠电子元器件。目前陶瓷产品的气密性封装主要采用Au80Sn20合金作为连接材料将盖板和管壳进行密封,Au80Sn20合金中Au与Sn元素的质量分数分别为80%和20%,是金锡二元合金的共晶成份,目的是在较低的温度和最短的时间内发生共晶反应,形成良好的密封结构。采用Au80Sn20合金对DIP20陶瓷管壳与盖板进行气密性封装,通过微观组织表征与X-ray测试观察金属间化合物的状态和元素分布,研究不同焊接温度和焊接压力对Au80Sn20合金焊接孔洞和微观组织的影响。在焊接峰值温度和焊接压力两个关键因素上进行优化,得出了减少气密性封装孔洞的最佳工艺参数组合,提高了Au80Sn20焊料气密性封装的可靠性,有助于提高元器件封装质量,在行业内具有一定的指导意义。Airtight packaging technology is widely used in highly reliable electronic components.At present,the hermetic encapsulation of ceramic products often uses Au80Sn20 alloy as the connecting material to seal the cover plate and pipe shell.The mass fractions of Au and Sn in Au80Sn20 alloy are 80%and 20%respectively,which is the eutectic component of gold-tin binary alloy.The purpose is to form a good sealing structure by eutectic reaction at a lower temperature and in the shortest time.DIP20 ceramic cartridge and cover plate which are sealed by Au80Sn20 alloy and observation of the state and element distribution of intermetal compounds by microtissue characterization and X-ray test to study the effect of different welding temperature and pressure on the welding pores and microstructure of Au80Sn20 alloy.By the optimization of the two key factors,peak welding temperature and welding pressure,the optimal combination of process parameters of reducing airtight packaging pores is obtained.It improves the reliability of Au80Sn20 solder airtight packaging,and it is helpful to improve the packaging quality of components and has certain guiding significance in the industry.

关 键 词：气密性封装 孔洞 工艺参数 最佳效果 

分 类 号：TN305.94[电子电信—物理电子学]