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作 者:白涛 董加和[1] 马晋毅[1] 蒋世义[1] 郑泽渔[1] 陈尚权 米佳[1] 冷俊林[1] 陈彦光[1] 杨桃均[1] 刘建国[1] BAI Tao;DONG Jiahe;MA Jinyi;JIANG Shiyi;ZHEN Zeyu;CHEN Shangquan;MI Jia;LENG Junlin;CHEN Yanguang;YANG Taojun;LIU Jianguo(The 26th Institute of China Electronic Technology Group Corporation,Chongqing 400060,China)
机构地区:[1]中国电子科技集团公司第二十六研究所,重庆400060
出 处:《压电与声光》2022年第2期199-201,共3页Piezoelectrics & Acoustooptics
摘 要:该文研制了一款频率3.4 GHz的S波段声表面波(SAW)滤波器。该滤波器采用一种由新型谐振器构成的阻抗元结构,能提升抗热释电静电损伤能力,用时可在一定程度上提升器件的功率承受能力。同时研制了尺寸为2.0 mm×1.6 mm的芯片级封装(CSP)基板。采用倒装焊工艺实现了芯片与CSP基板的电连接,降低了电磁寄生影响。结果表明,研制的SAW滤波器频率为3.408 GHz,插损为2.23 dB,8 GHz远端阻带大于30 dB,且实测的功率承受能力达到30 dBm。An S band surface acoustic wave(SAW)filter with center frequency of 3.4 GHz was developed in this work.The filter adopted an impedance element structure composed of a new type of resonator,which can improve the resistance to electrostatic damage(ESD)protection of pyroelectric effect,and improve the power handling ability to a certain extent.Furthermore,a kind of chip scale packaging(CSP)substrate with size of 2.0 mm×1.6 mm was developed.The electric connection between the chip and CSP substrate was realized by the flip-chip process,thus the electromagnetic parasitic influence was reduced.The developed S band SAW filter has center frequency of 3.408 GHz,insertion loss of 2.23 dB,above 30 dB the stopband suppression of greater than 30 dB at 8 GHz at the far end,the measured power handling ability of 30 dBm.
关 键 词:声表面波(SAW)滤波器 S波段 芯片级封装(CSP)
分 类 号:TN305.94[电子电信—物理电子学] TN65
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