新型无氰化学镀厚金工艺的研究  

Study on Formation of Thick Gold Layer in a New Cyanide Free Type Electroless Plating Process

作　　者：李彩然 路聪阁[1] 张佳琦 Li Cairan;Lu Congge;Zhang Jiaqi(The 13th Research Institute,CETC,Shijiazhuang 050000,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050000

出　　处：《广东化工》2022年第7期42-45,共4页Guangdong Chemical Industry

摘　　要：对无氰化学镀金工艺开发过程中遇到的一些常见工艺问题及相应的解决措施进行了简明阐述,确定了一种具有工艺可行性的镀金工艺路线,并结合镀金质量验证、XRD、扫面电镜、金丝球焊等方法,对所镀的金层性能进行了评估。结果表明:依据该工艺路线,可获得金层厚度0.5μm以上的光亮均匀的化学镀金层,金层性能稳定,可满足金丝球焊要求。This paper describes the problems encountered in the development of immersion thick gold plating process and the corresponding solutions. Then, a feasible process route of electroless gold plating was determined. Combined with XRD and scanning electron microscopy, we evaluate the performance of gold layers. The results show that a bright and uniform gold coating with a thickness greater than 1.3 μm can be obtained by this process route. Which can meet the requirements of gold wire ball welding.

关 键 词：无氰型镀液 化学镀 金层厚度 金层性能 金丝球焊 

分 类 号：TN05[电子电信—物理电子学] TG174.4[金属学及工艺—金属表面处理]