不同引线出线方式对QFP器件焊点振动应力的影响分析  

Impact Analysis of Different Outlet Methods of Leads on Vibration Stress of the QFP Device Solder Joints

作　　者：成鑫 醋强一[1] 刘治虎[1] 王滨 CHENG Xin;CU Qiang-yi;LIU Zhi-hu;WANG Bin(AVIC Xi′an Aeronautical Computing Technique Research Institute,Xi′an Shaanxi 710068,China)

机构地区：[1]西安航空计算技术研究所,陕西西安710068

出　　处：《机械研究与应用》2022年第2期43-44,48,共3页Mechanical Research & Application

基　　金：陕西省自然科学基础研究计划项目:PCB级多物理场协同数值仿真方法及应用研究(编号:2022JQ-564)。

摘　　要：主要分析QFP器件引线的不同出线方式对焊点振动应力的影响,通过有限元方法分别对引线从顶部、中间以及底部出线的QFP器件进行仿真对比,分析其对焊点应力的影响。结果显示,引线从顶部出线的QFP器件焊点振动应力小于焊点的疲劳极限,引线从中间和底部出线的QFP器件焊点振动应力大于焊点的疲劳极限,会很快发生失效。所研究内容为提高QFP器件可靠性提供指导。In this paper,the effect of different outlet methods of leads of QFP device on the vibration stress of solder joints is analyzed.By utilizing the finite element method,the QFP devices with leads outgoing from the top,middle and bottom are simulated and compared in order to analyze the effect of the outlet methods of leads on the vibration stress of solder joints.The results show that the vibration stress of the QFP device solder joints with leads from the top is smaller than the fatigue limit of the solder joints;while the vibration stress of the QFP device solder joints with leads from the middle and bottom are much larger than the fatigue limit of the solder joints,leading to rapid failure.The research content presented in this paper would provide guidance for improving the reliability of QFP devices.

关 键 词：QFP 有限元 引线出线方式 振动应力 

分 类 号：TG454[金属学及工艺—焊接]