应用于射频BGA外壳的无损测试夹具研发  

作　　者：李明磊[1] 乔志壮 刘林杰[1] 高岭[1] 任赞[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《科技创新与应用》2022年第15期120-122,126,共4页Technology Innovation and Application

摘　　要：文章根据各向异性导电胶膜(ACF)的特性设计一款可应用于射频BGA外壳的无损测试夹具,可同时适用于射频BGA外壳和器件的电性能测试。通过实际的测试对比分析,采用该夹具的测试结果与常规焊接方式的测试结果一致性好,具有测试性能准确、无损的特点,为外壳的电性能测试提供便利。According to the characteristics of anisotropic conductive film(ACF),a nondestructive testing fixture for RF BGA shell is designed,which can be used to test the electrical performance of RF BGA shell and devices at the same time.Through the comparative analysis of the actual test,the test results of the fixture are in good agreement with those of the conventional welding method,and have the characteristics of accurate test performance and non-destructive,which provides convenience for the electrical performance test of the shell.

关 键 词：各向异性 无损测试 微波测试 BGA 

分 类 号：TN405[电子电信—微电子学与固体电子学]