火焰熔融法制备电子封装用球形硅微粉制备与表征  

Preparation and Characterization of Spherical Silicon Powder for Electronic Packaging by Flame Melting Method

作　　者：谢强 管登高[2] 杨辉勇 Xie Qiang;Guan Denggao;Yang Huiyong(CECEP(Dazhou)New Material Co.,Ltd.,Sichuan,635000;College of Material and Chemistry&Chemical Engineering,Chengdu University of Technology,Sichuan,610059)

机构地区：[1]中节能(达州)新材料有限公司,四川635000 [2]成都理工大学材料与化学化工学院,四川610059

出　　处：《当代化工研究》2022年第11期18-20,共3页Modern Chemical Research

基　　金：2019年中节能资产经营有限公司自主新技术应用示范工程项目“电子封装级高性能球形硅微粉工程化成套装备及关键零部件开发应用项目”(项目编号:cecep-zdkj-2019-001)。

摘　　要：用火焰熔融法制备的球形硅微粉因其球形颗粒的表面流动性好、磨擦系数小等特点,适于用作电子集成电路的封装填料,其市场需求巨大。但国外对球形硅微粉的球化技术、关键装置实行技术壁垒。为打破我国高端球形硅微粉依赖进口的局面,亟需研发球形硅微粉的国产化球化制备技术与装置。本文介绍了中节能(达州)新材料有限公司用火焰熔融法制备球形硅微粉的方法,并对其样品进行了分析表征,对市场应用前景及经济和社会效益进行了分析。这对我国半导体集成电路行业的发展具有重要意义。Spherical silicon powder prepared by flame melting is suitable for packing electronic integrated circuits because of its good surface fluidity and small friction coefficient.The market demand is huge.However,foreign countries impose technical barriers on spheroidization technology and key devices of spherical silicon micropowder.In order to break the situation that China’s high-end spherical silicon micropowder relies on imports,it is urgent to develop domestic spheroidization preparation technology and devices of spherical silicon micropowder.This paper introduces the method of preparing spherical silicon micropowder by flame melting in CECEP(Dazhou)New Materials Co.,Ltd.,and analyses its samples.The market appli-cation prospect and economic and social benefits are analyzed.This is of great significance to the development of semiconductor IC industry in China.

关 键 词：球形硅微粉 火焰熔融法 二氧化硅 电子封装 

分 类 号：TB304.12[一般工业技术—材料科学与工程]