基于三维集成技术的X波段下变频模块电路的研制  

Research on X-band Down-conversion Module Circuit Based on 3D Integration Technology

作　　者：李昱坤 钱兴成[1] 潘碑 葛振霆 宋俊欣 LI Yukun;QIAN Xingcheng;PAN Bei;GE Zhenting;SONG Junxin(The 55th Research Institute of China Electronic Technology Group Corporation,Nanjing,210016,CHN)

机构地区：[1]中国电子科技集团公司第五十五研究所,南京210016

出　　处：《固体电子学研究与进展》2022年第2期124-129,共6页Research & Progress of SSE

摘　　要：为满足新一代模块组件的小型化、低成本、高性能、快速构建的需求,基于三维集成技术研制出一款X波段下变频模块的系统级封装模块。本设计采用三维垂直互联技术和板级堆叠(POP)技术,实现8~12 GHz信号的两次下变频功能。模块内部集成放大器、滤波器、开关和数控衰减器等,通过电磁及热力学联合仿真确保了模块具备良好的电气性能和散热性能。测试结果表明,该模块接收增益大于55 dB,噪声系数小于6 dB,杂散抑制大于60 dBc,并可工作于+85℃的环境温度之中。In order to meet the requirements of the new generation module in miniaturization,low cost,high performance and rapid construction,an X-band down-conversion module with system in package technology was developed in this paper based on 3D integration technology.It adopts three-dimensional vertical interconnection and package-on-package stacking technologies and realizes the function of double down-conversion from 8 to 12 GHz.Amplifiers,filters,switches and digital attenuators are integrated in the module.Through electromagnetic and thermodynamic joint simulation,the module has good electrical performance and heat dissipation performance.The test results show that the receiving gain of this module is greater than 55 dB,the noise figure is less than 6 dB,the spurious suppression is greater than 60 dBc,and it can work in an ambient temperature of+85℃.

关 键 词：系统级封装 垂直互联技术 下变频 

分 类 号：TN45[电子电信—微电子学与固体电子学]