高端芯片技术特点及测评难点分析  

Analysis of Technology Characteristics and Evaluation Difficulties of High-end Chip

作　　者：王小强[1,2] 李斌[1] 余永涛[2] 王斌[3] 翁章钊 WANG Xiaoqiang;LI Bin;YU Yongtao;WANG Bin;WENG Zhangzhao(South China University of Technology,Guangzhou 510641,China;CEPREI,Guangzhou 511370,China)

机构地区：[1]华南理工大学,广东广州510641 [2]工业和信息化部电子第五研究所元器件检测中心,广东广州511370 [3]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2022年第3期100-106,共7页Electronic Product Reliability and Environmental Testing

基　　金：广东省科技厅重点研发计划项目(2020B0404030005);广东省发改委项目(广东省高端芯片可靠性工程研究)资助。

摘　　要：以CPU、 FPGA、 5G SoC等为代表的高端芯片水平是国家高新技术实力的综合体现,代表了国家的高新技术的发展水平,关乎国家的信息安全和经济安全,是国家之间竞争的战略制高点。与传统芯片相比,高端芯片在功能性能、工艺制程和封装结构等方面具有显著的技术特征,对芯片测评技术也提出了挑战。在总结传统集成电路产品分类的基础上,通过对CPU、 FPGA和5G SoC等典型高端芯片产品的技术性能指标分析,总结了高端芯片的技术特点及测评技术难点,可为芯片测评工程实践提供技术参考。The level of high-end chips represented by CPU,FPGA and 5G SoC is the comprehensive reflection of the national high-tech strength,it represents the national high-tech development level,and is also the strategic commanding point of competition between countries.Compared with traditional chips,high-end chips have typical common technical characteristics in terms of functional performance,process and packaging structure,which also pose challenges to chip evaluation techniques.On the basis of summarizing the classification of traditional integrated circuit products,through the analysis of the technical performance indicators of typical high-end chip products such as CPU,FPGA,and 5G SoC,the technical characteristics and evaluation technical difficulties of high-end chips are summarized,which can provide technical reference for chip evaluation engineering practice.

关 键 词：高端芯片 测评技术 先进工艺 先进封装 

分 类 号：TN40[电子电信—微电子学与固体电子学]