高抗振双质量块硅微陀螺仪  

High Anti-Vibration Dual-Mass Silicon Microgyroscope

作　　者：张志勇 杨拥军[1] 任臣[1] 徐淑静[1] 付迪 Zhang Zhiyong;Yang Yongjun;Ren Chen;Xu Shujing;Fu Di(The 13^(th) Research Institute,CETC,Shijiazhuang 050051,China;MT Microsystems Co.,Ltd.,Shijiazhuang 050299,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051 [2]河北美泰电子科技有限公司,石家庄050299

出　　处：《微纳电子技术》2022年第6期558-563,569,共7页Micronanoelectronic Technology

摘　　要：设计并制备了一种高抗振双质量块硅微陀螺仪。阐述了双质量块陀螺仪的工作原理,分析了陀螺仪抗振性能较差的原因。在此基础上,采用差分梳齿电容检测结构和双质量块耦合结构对陀螺仪敏感结构进行了优化,通过抑制线振动共模干扰信号、提高工作模态频率、隔离干扰模态频率,提高了陀螺仪的抗振性能。利用绝缘体上硅(SOI)体硅加工工艺和圆片级气密封装技术实现了陀螺仪芯片的加工,采用无引脚芯片载体(LCC)封装实现了陀螺仪的立体集成封装。封装后陀螺仪整体尺寸为9.0 mm×9.0 mm×2.8 mm,功耗为125 mW,质量为0.9 g。测试了陀螺仪的典型性能参数,陀螺仪量程达到±500°/s,角度随机游走为0.036°√h,随机振动实验中零偏稳定性和零偏差分别为2°/h和2.7°/h,能够满足大部分工程应用需求。A high anti-vibration dual-mass silicon microgyroscope was designed and fabricated.The working principle of the dual-mass gyroscope was expounded.The reasons for poor anti-vibration performance of the gyroscope were analyzed.On this basis,the sensitive structure of the gyroscope was optimized by differential comb capacitance detection structure and dual-mass coupling structure.By suppressing the line vibration common-mode interference signal,increa-sing the working modal frequency and isolating the interference modal frequency,the anti-vibration performance of the gyroscope was improved.The gyroscope chip was realized by using silicon-on-insulator(SOI)bulk silicon process and wafer level vacuum packaging technology.The stereo integrated package of the gyroscope was realized by the leadless chip carrier(LCC)packaging.The overall size of the gyroscope after packaging is 9.0 mm×9.0 mm×2.8 mm,the power consumption is 125 mW,and the mass is 0.9 g.The typical performance parameters were measured.The range of the gyroscope reaches ±500°/s,the angle rand walk is 0.036°√h,the zero bias stability and zero deviation in the random vibration experiment are 2°/h and 2.7°/h respectively,which can meet most engineering application requirements.

关 键 词：微电子机械系统(MEMS) 陀螺仪 双质量块 立体集成封装 圆片级气密封装 

分 类 号：TH703[机械工程—仪器科学与技术] V241.5[机械工程—精密仪器及机械]