QFN器件封装技术及焊点可靠性研究进展  

Review of Packaging Technology and Solder Joint Reliability about QFN Devices

作　　者：皋利利 周波华 李超 沈东波 汪智萍 GAO Lili;ZHOU Bohua;LI Chao;SHEN Dongpo;WANG Zhiping(Shanghai Radio Equipment Research Institute,Shanghai 200090,China;Shanghai Academy of Spaceflight Technology,Shanghai 200090,China)

机构地区：[1]上海无线电设备研究所,上海200090 [2]上海航天技术研究院,上海200090

出　　处：《电子工艺技术》2022年第4期196-199,203,共5页Electronics Process Technology

基　　金：国防科工局“双百”项目。

摘　　要：针对行业中典型塑封QFN器件的特点进行分析,并对其组装技术及焊点可靠性的研究进展进行概述,分析了影响QFN器件焊点可靠性的主要因素,为典型QFN器件的选择及高可靠组装提供参考。Packaging characteristics about typical plastic quad-flat no-leads(QFN)package devices are introduced.Research progresses on assembly technologies and solder joint reliability are summarized.Main factors affecting the solder joint reliability are analyzed.The results can give references for the appropriate choice of QFN devices,and can provide high-reliability assembly processes for QFN devices.

关 键 词：QFN器件 封装技术 焊点可靠性 

分 类 号：TN40[电子电信—微电子学与固体电子学]