低翘曲BGA封装用环氧塑封料开发与应用  

Development and Application of Epoxy Molding Compound for Low Warpage BGA Package

作　　者：李进 邵志锋 邱松 沈伟 潘旭麒 LI Jin;SHAO Zhifeng;QIU Song;SHEN Wei;PAN Xuqi(Eterkon Semiconductor Materials Co.,Ltd.,Kunshan 215301,China;Wuxi CR Huajing Microelectronics Co.,Ltd.,Wuxi 214061,China)

机构地区：[1]昆山兴凯半导体材料有限公司,江苏昆山215301 [2]无锡华润华晶微电子有限公司,江苏无锡214061

出　　处：《电子与封装》2022年第7期13-19,共7页Electronics & Packaging

摘　　要：随着半导体封装密度的提高,FBGA等单面封装形式被广泛采用。在这些封装中,由于其非对称结构容易发生翘曲,且大面积封装基板也越来越薄,降低翘曲的要求也越来越高。为了减少单面封装的翘曲,有报道称,通过提高玻璃化转变温度(T_(g))和降低封装材料的线膨胀系数来降低成型收缩率是有效的。然而,要保持环氧塑封料的高流动性并大幅降低成型收缩率是很困难的。将固化收缩率引入热粘弹性分析技术,明确了BGA封装翘曲的发生机制,采用降低高温弯曲模量的方法可以设计出具有低粘度、高流动性和低翘曲的环氧塑封料。With the improvement of semiconductor packaging density,single-sided packages such as FBGA are widely used.In these packages,warpage is easy to occur due to their asymmetric structure,and the substrate of large-area package is thinner and thinner,so the requirement to reduce warpage is higher and higher.In order to reduce the warpage of single-sided package,it has been reported that it is effective to reduce the molding shrinkage rate by increasing the glass transition temperature(T_(g))and reducing the linear expansion coefficient of package materials.However,it is difficult to maintain the high flowability of epoxy molding compound and significantly reduce molding shrinkage rate.The curing shrinkage rate is introduced into the thermal viscoelasticity analysis technology,the mechanism of BGA package warpage is clarified,and the EMC with low viscosity,high flowability and low warpage is designed by reducing the high temperature flexural modulus.

关 键 词：高密度封装 翘曲 收缩 

分 类 号：TN305.94[电子电信—物理电子学]