小型化滤波放大器三维集成设计  

3D Integration Design of Miniaturized Filtering Amplifier

作　　者：王磊[1] 白锐[1] 魏少伟 张韶华 WANG Lei;BAI Rui;WEI Shaowei;ZHANG Shaohua(The 13th Research Institute,CETC,Shijiazhuang,050051,CHN)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《固体电子学研究与进展》2022年第3期201-206,共6页Research & Progress of SSE

摘　　要：针对滤波放大器中滤波器体积大、数量多的特点,提出了一种基于三维集成技术的小型化设计方法。该方法利用球栅阵列连接,实现多个基板的三维集成互联组装。将放大电路置于下层基板,滤波器置于中间层基板,上层基板作为滤波器的屏蔽层,通过焊球实现信号互通和电磁屏蔽隔离。该设计可缩小多个滤波器级联时电路布局尺寸,为实现高集成、小型化、多功能的滤波放大器产品提供了有效的解决方案。For too large and more filters in filtering amplifier circuit,a design method of miniaturization circuit based on the three-dimensional(3D)integration technology was introduced in this paper. Multi-substrates are assembled and interconnected in 3D integration by ball grid array(BGA).The amplifier circuit is placed on the bottom-substrate,filters are placed on the middle-substrate and the top-substrate is used as the shielding layer. The signal transmission and electromagnetic shield are realized by soldering ball. This design method has reduced circuit layout size of multi-filters cascading,and provides effective solution for realizing high integration,miniaturization and multi-function filtering amplifier.

关 键 词：小型化 滤波放大器 三维集成 球栅阵列 

分 类 号：TN454[电子电信—微电子学与固体电子学]