BCB键合层空洞对界面热阻的影响  

Effect of BCB bonding layer void on interfacial thermal resistance

作　　者：郭怀新[1] 王瑞泽 吴立枢[1] 孔月婵[1] 陈堂胜[1] GUO Huaixin;WANG Ruize;WU Lishu;KONG Yuechan;CHEN Tangsheng(Science and Technology on Monolithic Integrated Circuits and Modules Laboratory,Nanjing Electronic Devices Institute,Nanjing210016,China)

机构地区：[1]南京电子器件研究所微波毫米波单片集成和模块电路重点实验室,江苏南京210016

出　　处：《电子元件与材料》2022年第7期758-762,共5页Electronic Components And Materials

基　　金：国家自然科学基金(61904162)。

摘　　要：晶圆级键合的纳米界面层热传递控制是微机电系统热管理和热设计的热点及难点,其原因是由于键合质量严重影响纳米界面层的热传输能力,而圆片级键合界面热阻表征技术则是业界难点,国内外未见有效的分析途径和统一的测试方法。基于超声扫描、激光闪射法和自主构建的热阻网格化计算模型相结合的分析途径,实现了对微机电系统中圆片级封装的Si-BCB-Si键合质量及热阻的表征。首先,利用超声扫描显微镜对BCB键合界面质量进行分析,定性评估了键合区空洞含量;同时,采用激光闪射法对界面层热扩散率进行测试,最后,结合数值计算方法,定性评估了空洞含量和BCB键合层厚度对界面热阻的影响。试验和理论分析表明,BCB键合层的空洞严重阻碍了界面层的热传输能力,且这种阻碍作用受BCB界面层厚度的影响。The bonding quality could seriously affect the thermal transfer capability at the nanoscale interface.However,the thermal resistance characterization of wafer level bonding at the interface is difficult in industry,and there is no effective analytical approach and standard testing method for that at home and abroad.As a result,thermal transfer control of wafer level bonding at the nanoscale boundary has become a hotpot and challenge in thermal management and design of micro-electromechanical systems.In this article,acoustic scanning,laser thermal flash and self-constructed grid calculation model were used to analyze the thermal resistance.Based upon these methods,the bonding quality and thermal resistance of Si-BCB-Si structure were characterized for wafer level packaging.First,the quality of BCB bonding interface was analyzed by acoustic scanning microscope,and the void concentration at the boundary were qualitatively evaluated.Meanwhile,the laser flash technology was used to determine the thermal diffusivity.Finally,the effects of void concentration and bonding thickness on the boundary thermal resistance were qualitatively evaluated by numerical method.Experiments and theoretical analysis indicate that the void of BCB bonding layer can seriously hinder the thermal transfer capability of BCB interface layer,which is affected by the bonding thickness of BCB.

关 键 词：苯并环丁烯(BCB) 空洞 激光闪射法 界面热阻 

分 类 号：TN305[电子电信—物理电子学]