基于SPI的锡膏喷印检测参数的分析  

Parameter Analysis of Solder Paste Spray Printing Detection Based on SPI

作　　者：魏斌 梁佩 席赟杰 马诗行 周亚丽 陈海峰 WEI Bin;LIANG Pei;XI Yunjie;MA Shihang;ZHOU Yali;CHEN Haifeng(The 58th Research Institute of CETC,Wuxi 214072,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214072

出　　处：《电子工艺技术》2022年第5期295-298,共4页Electronics Process Technology

摘　　要：锡膏喷印技术作为无钢网的新型锡膏涂覆技术,以其便利性和灵活性在军工电子产品生产中体现出实用价值,但目前对于喷印工艺及喷印的SPI(Solder Paste Inspection,锡膏检测)应用相关研究尚未完善。以0.12 mm钢网印刷技术为参考目标,通过SPI设备采集相关数据,经过数学分析计算,获得了不同封装器件锡膏喷印工艺参数和SPI阈值。最后,通过镜检检验,验证了试验结果的可行性及焊点可靠性,验证试验显示,喷印焊点质量满足IPC610 III级要求,焊点在高低温环境下的适应能力较强。As a new type of solder paste coating technology without steel mesh,solder paste spray printing technology embodies practical value in the production of military electronic products with its convenience and flexibility.But,the research on solder paste spray printing technology and SPI(Solder Paste Inspection) application are not perfect.Taking 0.12 mm steel screen printing technology as the reference target,the relevant data are collected by SPI equipment,and the solder paste printing process parameter and SPI detection threshold of different package devices are obtained through mathematical analysis and calculation.Finally,the feasibility of the test results and the reliability of solder joints are verified by microscopic examination.The verification test shows that the quality of spray printed solder joints meets the requirement of IPC610 III,and the solder joints have strong adaptability in high and low temperature environment.

关 键 词：锡膏喷印 SPI阈值 工艺参数 焊点可靠性 温度循环 

分 类 号：TN407[电子电信—微电子学与固体电子学]