环氧塑封料用热潜伏型固化促进剂的研究与应用进展  

Progress on the Research and Application of Thermally Latent Curing Accelerators in Epoxy Molding Compound

作　　者：王璐 常白雪 岳艺宇 吴宇林 吴昊 陈淑静[1] 刘金刚[1] WANG Lu;CHANG Baixue;YUE Yiyu;WU Yulin;WU Hao;CHEN Shujing;LIU Jingang(School of Materials Science and Engineering,China University of Geosciences,Beijing 100083,China)

机构地区：[1]中国地质大学(北京)材料科学与工程学院,北京100083

出　　处：《电子与封装》2022年第9期1-8,共8页Electronics & Packaging

基　　金：深圳市科技计划项目(技术攻关重点项目)(JSGG20210629144539012);山东省重点研发计划项目(2019JZZY020235)。

摘　　要：环氧塑封料(EMC)是集成电路(IC)芯片封装的关键材料之一,而固化促进剂又是影响EMC在IC封装应用中的可靠性的重要成分之一。综述了近年来国内外EMC用热潜伏型固化促进剂(TLC)在基础与应用领域中的研究进展。从IC封装用EMC的发展趋势、EMC的发展对TLC的性能需求以及当前IC封装应用中的主流EMC相关TLC材料的研究现状等几个方面进行了阐述。重点阐述了有机磷系络合型本征型TLC的研究与发展状况,对先进EMC用TLC组分的未来发展趋势进行了展望。Epoxy molding compound(EMC)is one of the key materials for packaging of IC chip,while curing accelerator is one of the important components affecting the reliability of EMC in IC packaging.The progress on the research and application of thermally latent curing accelerators(TLC)in EMC have been reviewed in recent years.The developing trend of EMC for IC packaging,the performance requirements of TLC for EMC,and the research status on main types of TLC for the current EMC products in IC packaging are mainly introduced.Emphatically,the development status of phosphorus complexes types of intrinsic TLC compounds is presented.The future development trend of TLC components in advanced EMC is prospected.

关 键 词：集成电路封装 环氧塑封料 固化促进剂 热潜伏性 

分 类 号：TM215.1[一般工业技术—材料科学与工程] TQ323.5[电气工程—电工理论与新技术]