共晶平台开发IC新产品的探讨  

Discussion of Developing New IC Products on Eutectic Platform

作　　者：胡敏 HU Min(Leshan Radio Co.,Ltd.,Leshan,614000,China)

机构地区：[1]乐山无线电股份有限公司,四川乐山614000

出　　处：《电子与封装》2022年第9期17-20,共4页Electronics & Packaging

摘　　要：共晶芯片焊接平台因具有高效、低热阻、低成本等优势,被广泛用于表面贴装半导体分立器件的芯片焊接。随着移动消费电子产品的大量使用,越来越多的IC芯片被放置到小型表面封装中。对于底部没有金属化的小型IC芯片,经比较证明共晶焊接工艺优于聚合物粘接剂粘接,将低噪声放大器IC芯片以共晶焊接的方式组装到SC88封装中,并通过可靠性测试,成功实现量产。Eutectic die bonding platform is widely used in surface mount discrete semiconductor assembly due to its high efficiency,low thermal resistance and low cost.With the extensive use of mobile consumer electronics,more and more IC chips are placed into small surface packages.For the small IC chip without backmetal on the bottom,the eutectic bonding process is proved to be better than polymer bonding,and the low noise amplifier IC chip is assembled into the SC88 package by eutectic bonding,and it has passed the reliability test and successfully achieved mass production.

关 键 词：共晶芯片焊接平台 IC芯片 低噪声放大器 

分 类 号：TN605[电子电信—电路与系统]