CBGA与PBGA封装焊点热循环失效特性研究  

Research on Thermal Cycle Failure of Solder Jiont in CBGA and PBGA Packages

作　　者：刘勇 潘邈 刘绍辉 杜映洪 Liu Yong

机构地区：[1]中科芯集成电路有限公司,江苏无锡214072

出　　处：《工业控制计算机》2022年第10期156-158,共3页Industrial Control Computer

摘　　要：陶瓷球栅阵列(CBGA)与塑料焊球阵列(PBGA)是系统级封装(SIP)器件主流的两种封装形式。主要对CBGA和PBGA两种系统级封装器件的焊点在热循环试验中寿命进行分析研究。通过对锡(Sn)合金焊料的粘塑性特性进行研究,对热循环疲劳寿命Coffin-Manson方程理论进行分析,结合仿真软件的计算,对两种封装形式焊点寿命进行定量预测。预测结果表明,CBGA封装焊点热循环条件下失效寿命约240余次,远低于PBGA封装焊点寿命1900余次。Ceramic ball grid array(CBGA) and plastic solder ball array(PBGA)are system level packaging(SIP) two mainstream packaging forms of devices. This paper mainly analyzes and studies the solder joint life of CBGA and PBGA packaging devices in thermal cycle test. Through the research on the viscoplastic characteristics of tin alloy solder, the theoretical analysis of thermal cycle fatigue life Coffin Manson equation, combined with the calculation of simulation software, the solder joint life of the two packaging forms is quantitatively predicted. The results show that the failure life of CBGA packaging solder joint under thermal cycle is about 240 times, which is much lower than that of PBGA packaging solder joint.

关 键 词：CBGA PBGA SIP 热循环试验 疲劳寿命 

分 类 号：TN405[电子电信—微电子学与固体电子学] TQ320.7[化学工程—合成树脂塑料工业] TQ174.1