塑封器件漏电失效分析及解决措施  

Leakage Failure Analysis and Solutions of Plastic Encapsulated Device

作　　者：朱召贤 杨兵[1] 王涛[1] ZHU Zhaoxian;YANG Bing;WANG Tao(The 58th Research Institute of CETC,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子产品可靠性与环境试验》2022年第5期56-60,共5页Electronic Product Reliability and Environmental Testing

摘　　要：对漏电失效的某款高可靠塑封器件通过SAT、 X-ray、微光显微镜和SEM等分析手段,定位了器件的失效位置,揭示了因键合工艺参数不适配引起芯片上的铝PAD层破坏致使器件漏电失效的失效模式及失效机理,归纳总结了塑封器件的失效分析流程并针对漏电失效模式提出了相应的优化改进措施,对于提高塑封器件产品的可靠性具有一定的参考意义。For a high-reliability plastic-packaged device with leakage failure, through the analysis methods of SAT, X-Ray, low-light microscope and SEM, the failure position of the device is located, and the failure mode and failure mechanism of the leakage failure of the device caused by the failure of the aluminum PAD layer on the chip caused by the incompatibility of the bonding process parameters are revealed, and the failure analysis process of plastic encapsulated devices is summarized and the related corrective actions are presented, which has certain reference value for improving the reliability of products.

关 键 词：塑封器件 漏电 失效分析 改进措施 

分 类 号：TN405[电子电信—微电子学与固体电子学]