MEMS微波功率传感器模塑封工艺参数优化设计  

Optimum Design of MEMS Microwave Power Sensor Molding and Packaging Process Parameters

作　　者：唐荣芳[1] 余鹏[1] 庞广富 TANG Rong-fang;YU Peng;PANG Guang-fu(Guangxi Vocational&Technical Institute of Industry,Nanning 530001,China)

机构地区：[1]广西工业职业技术学院,广西南宁530001

出　　处：《塑料科技》2022年第9期105-108,共4页Plastics Science and Technology

基　　金：2022年广西高校中青年教师科研基础能力提升项目资助(2022KY1291)。

摘　　要：为改善微机电系统(MEMS)传感器在塑封过程中产生的金线偏移封装缺陷,对MEMS微波功率传感器模塑封工艺参数进行优化设计。通过正交试验,探究金线偏移与模塑封工艺参数之间的关系。结果表明:各工艺参数对金线偏移均具有显著影响,影响程度排序为:塑件温度>注射时间>铸件湿度>铸件温度,最优组合的工艺参数为A3B1C2D3。采用最优组合的工艺参数进行MEMS微波功率传感器模塑封试验,金线偏移量数值可以达到实际需要,可以优先考虑使用该工艺参数进行模塑封。In order to improve the gold wire offset packaging defect of micro-electromechanical system(MEMS) sensor in the process of plastic packaging,the molding process parameters of MEMS microwave power sensor were optimized.The relationship between gold wire offset and molding process parameters was explored by orthogonal test.The results show that each process parameter has a significant effect on the gold wire offset.The order of influence degree is:plastic part temperature>injection time>casting humidity>casting temperature.The optimal combination of process parameters is A3B1C2D3.Using the optimal combination of process parameters for MEMS microwave power sensor molding test,wire offset value can meet the actual needs.Priority can be given to using this process parameter for molding sealing.

关 键 词：微机电系统 微波功率传感器 金线偏移 正交试验 

分 类 号：TQ320.52[化学工程—合成树脂塑料工业] TP391.7[自动化与计算机技术—计算机应用技术]