In的添加对Sn-9Zn无铅焊料合金组织与性能的影响  

Microstructure and Properties of Sn-9Zn Lead-Free Solder Alloy with In Addition

作　　者：杨娇娇 彭言之 陈东东[1,2] 白海龙 李才巨 易健宏[1] Yang Jiaojiao;Peng Yanzhi;Chen Dongdong;Bai Hailong;Li Caiju;Yi Jianhong(Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming 650501,China;Research and Development Center of Yunnan Tin Group(Holding)Co.Ltd,Kunming 650000,China)

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093 [2]云南锡业锡材有限公司,云南昆明650501 [3]云南锡业集团(控股)有限责任公司研发中心,云南昆明650000

出　　处：《稀有金属》2022年第8期1031-1040,共10页Chinese Journal of Rare Metals

基　　金：云南省稀贵金属材料基因工程重大科技专项(2019ZE001-3,202002AB080001);国家自然科学基金项目(52061021);云南省中青年学术和技术带头人后备人才项目(202005AC160039)资助。

摘　　要：锡锌(Sn-Zn)无铅焊料在电子封装中具有广阔的应用前景,但其润湿性和抗氧化性能较差。采用16通道摇摆炉制备Sn-9Zn-x In(x=0,1,2,3,4;%,质量分数)焊料合金,研究In元素对Sn-9Zn无铅焊料合金微观组织、熔化特性、润湿性、抗氧化性以及力学性能的影响。结果表明:添加的In元素与Sn,Zn形成低熔点合金,明显降低焊料合金的熔点及固相线温度;加入In元素使得焊料合金表面张力降低,润湿性能提高;焊料合金的润湿力在In含量为3%达到最大值(0.857 mN);焊料添加In元素形成In_(2)O_(3)氧化膜有保护熔体的作用,有助于增强焊料合金抗氧化性能,不含In元素时焊料合金的氧化增重为0.47%,而In含量为3%时其氧化增重质量分数为0.14%,抗氧化性能提高;添加In后在Sn基体中产生固溶强化和析出强化使得合金抗拉强度先提高后降低,当In含量为3%时,焊料合金极限抗拉强度达到55 MPa左右。加入In后破碎为长条状、针棒状的富Zn相使得延伸率逐渐下降,当In添加量大于3%时,延伸率急剧下降。综合焊料的力学性能、润湿性、抗氧化性能,确定In的在Sn-9Zn中最优添加量为3%。With the development of the lead-free solder process in electronic packaging,the main challenge in the development of lead-free solder alloys is to obtain a suitable melt point,optimal wettability,well alloy structure stability,admirable oxidation resistance,and the raw material supply are sufficient to meet the needs of industrialization.Tin-zinc(Sn-Zn)alloys with excellent mechanical properties creep resistance and melting point which is closer to eutectic Sn-Pb solder have been considered as the most promising candidates for replacing the traditional Sn-Pb solder alloy.However,the solder wettability and oxidation resistance of Sn-Zn lead-free solder are not as good as expected.Wettability is an important index to evaluate the performance of lead-free solder and the key to form reliable solder joint and oxidation resistance is closely related to the service life of solder.Therefore,improving the wettability and oxidation resistance properties of Sn-Zn lead-free solder alloy is extremely necessary.A 16-channel swing furnace was used to prepare Sn-9Zn-In solder alloy with different In content.The microstructure and properties,characterization and analysis systematically were analyzed by differential scanning thermal analyzer(DSC),solderability tester,universal testing machine,scanning electron microscope(SEM),energy dispersive analysis(EDS)and thermal gravimetric analyze(TG).The melting characteristics and the microstructure of Sn-9Zn solder with different In elements were compared,the feasibility of Sn-Zn alternate Sn-Pb solder was discussed.In addition,In element was doped into Sn-9Zn to investigate the wettability,oxidation resistance,and mechanical properties of Sn-9Zn lead-free solder alloy.The effect of In on the wettability and oxidation property of Sn-Zn solder was emphatically discussed.The oxidation resistance of solder was judged by the method of oxidative weight gain,X-ray photoelectron spectroscopy(XPS)was used for qualitative analysis of the components of the solder oxidation products.The results sh

关 键 词：锡锌铟合金 无铅焊料 润湿性 抗氧化性 

分 类 号：TG425[金属学及工艺—焊接]