硅含量对硅铝合金电子封装材料性能的影响  

Effect of Si Content on the Properties of Si-Al Alloy Electronic Packaging Materials

作　　者：李海军 宗福春 胡增武 李云飞 彭文佳 齐敬 LI Haijun;ZONG Fuchun;HU Zengwu;LI Yunfei;PENG Wenjia;QI Jing(Hebei New Lizhong Nonferrous Metals Group Co.,Ltd.,Baoding 071100,China)

机构地区：[1]河北新立中有色金属集团有限公司,河北保定071100

出　　处：《电子与封装》2022年第12期17-22,共6页Electronics & Packaging

摘　　要：以热等静压方法成形的AlSi12、AlSi27、AlSi35、AlSi42、AlSi50、AlSi60、AlSi70、AlSi80系列的硅铝合金电子封装材料为研究对象,对Si含量对材料的金相组织、热物理性能、力学性能等的影响进行分析评估。结果发现,随着Si含量的增加,合金材料的密度、热导率、热膨胀系数(CTE)、断后伸长率降低,刚度、硬度提高;当Si的质量分数不大于60%时,随着Si含量的增加,材料强度提高,Si颗粒由点状或蠕虫状变为球状或片状,且分布均匀、独立。当Si的质量分数大于60%时,材料强度降低,Si颗粒逐渐连接成骨架基体。Taking AlSi12,AlSi27,AlSi35,AlSi42,AlSi50,AlSi60,AlSi70,AlSi80 series of silicon aluminum alloy electronic packaging materials formed by hot isostatic pressing as the research objects,the influence of Si content on the microstructure,thermal and physical properties and mechanical properties of the materials is analyzed and evaluated.The results show that the density,thermal conductivity,coefficient of thermal expansion(CTE)and elongation after fracture of the alloy decrease,while the stiffness and hardness increase with the increase of Si content.When the mass fraction of Si is less than or equal to 60%,the strength of the material increases with the increase of Si content,and the Si particles change from dotted or wormlike to spherical or flake,and the distribution of Si is uniform and independent.When the mass fraction of Si is more than 60%,the material strength decreases,and the Si particles gradually connect to form a skeleton matrix.

关 键 词：硅铝合金 电子封装材料 物理性能 力学性能 金相组织 

分 类 号：TN305.94[电子电信—物理电子学]