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作 者:石素君 赵修臣[1] 李红[1] 郑冰 赵永杰[1] 许兴燕 SHI Sujun;ZHAO Xiuchen;LI Hong;ZHENG Bing;ZHAO Yongjie;XU Xingyan(School of Materials Science&Engineering,Beijing Institute of Technology,Beijing 100081,China)
出 处:《实验科学与技术》2022年第6期98-102,共5页Experiment Science and Technology
基 金:北京理工大学教育教学改革项目(2017)。
摘 要:以卓越工程师教育培养计划为背景,电子封装技术专业探索了校企协同育人的人才培养模式,以解决学校教育与产业实际脱节问题。通过构建企业参与式的多层次校企协同融合工程实践教学体系,搭建企业延伸式的全链条实践教学平台,建立企业贯穿式的多元化实践教学模式,切实全面提升了人才培养质量,培养了既满足行业企业要求又具有较强的工程实践与工程创新能力的卓越工程技术人才。With the background of excellent engineer education training plan,the major of electronic packaging technology explores the talent cultivation mode of school-enterprise cooperative education to solve the problem of disconnection between school education and industrial reality.By constructing a multi-level school-enterprise cooperative integration engineering practice teaching system with enterprise participation,building a whole chain practice teaching platform with enterprise extension,and establishing a diversified practice teaching mode with enterprise penetration,the quality of talent cultivation has been improved comprehensively,and excellent engineering talents with strong engineering practice and engineering innovation ability have been cultivated to meet the requirements of industry enterprises.
分 类 号:G642.0[文化科学—高等教育学]
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