高密度陶瓷外壳焊盘位置度的标注与测量方法  

Marking and Measuring Method of Pad Position for High Density Ceramic Shell

作　　者：刘洋 杨振涛 刘林杰[1] LIU Yang;YANG Zhentao;LIU Linjie(China Electronics Technology Group Corporation No.13 Research Institute,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《电子与封装》2023年第2期34-40,共7页Electronics & Packaging

摘　　要：高密度陶瓷焊盘阵列外壳的焊盘位置度偏差直接影响着封装质量和可靠性。对国内外的位置度相关标准和标注方法进行了对比分析,给出了目前较为合理的位置度公差标注方法。在对现有位置度的测量方法进行分析的基础上,结合理论及数据分析,提出了一种采用抽取特征部位的焊盘测量的方法,该方法能够高效且准确地获得高密度外壳焊盘的位置度。将采用该测量方法测试合格的样品进行了封装验证,证明了标注与测量方法的合理性。The packaging quality and reliability are directly affected by pad position deviation of high-density ceramic pad array shell. The relative standards and marking methods of positional tolerance at home and abroad are compared and analyzed, and the current reasonable method of position tolerance marking is given. Based on the analysis of the existing position measurement methods, and combined with the theory and data analysis, this paper proposes a method of pad measuring by extracting characteristic parts, which can obtain the position degree of high-density shell pads efficiently and accurately. The samples those passed the test by this measurement method are encapsulated and verified, the rationalities of the labeling and measurement method are proved.

关 键 词：高密度陶瓷外壳 焊盘 位置度公差 

分 类 号：TN305.94[电子电信—物理电子学]