球栅阵列芯片锡球的三维检测方法研究  

3D detection method research of solder ball in ball grid array chip

作　　者：梁天为 朱呈祥 陈浩 杨光 LIANG Tianwei;ZHU Chengxiang;CHEN Hao;YANG Guang(School of Electrical Engineering and Automation,Jiangsu Normal University,Xuzhou 221116,China;MatrixTime(Shanghai)Co Ltd,Shanghai 201100,China)

机构地区：[1]江苏师范大学电气工程及自动化学院,江苏徐州221116 [2]聚时科技(上海)有限公司,上海201100

出　　处：《传感器与微系统》2023年第2期20-23,共4页Transducer and Microsystem Technologies

基　　金：江苏省高校自然科学研究项目(16KJB120001)。

摘　　要：为提高球栅阵列(BGA)芯片锡球三维检测精度,克服从点云做直接处理的低效率,提出一种新的BGA芯片锡球三维检测方法。该方法通过采集芯片点云并沿Z方向投影转换为深度图像,利用连通域分析方法标记各锡球区域,拟合基座表面获得方程参数,提取锡球区域的二维中心坐标及其8邻域像素对应的三维坐标点,并求取平均赋值给锡球顶部三维点。在标记锡球区域时,结合形态学方法将锡球逼近圆形化以提高算法的鲁棒性。最后,计算顶点到拟合表面的距离得到锡球高度及其共面度。运行耗时表明:该算法可有效地应用于实时检测。实验的重复性精度也获得了满意的结果。In order to improve the precision of 3D inspection of solder balls on ball grid array(BGA)chip and overcome the inefficiency of direct processing from point cloud,a new 3D inspection method of solder balls on BGA chip is proposed.In this method,the chip point cloud is collected and projected into a depth image along the Z direction.The connected component analysis method is used to mark each solder ball area,and the equation parameters are obtained by fitting the surface of the base.The 2D center coordinates of the solder ball area and the 3D coordinate points corresponding to its eight neighboring pixels are extracted,and the average value is calculated and assigned to the 3D points on the top of the solder ball.When marking the solder ball area,the morphological method is combined to round the solder ball to improve the robustness of the algorithm.Finally,the distance from the vertex to the fitting surface is calculated to obtain the height and coplanarity of the solder ball.The running time shows that the algorithm can be effectively applied to real-time detection.Satisfactory results are obtained for the repeatability precision of the experiment.

关 键 词：芯片检测 球栅阵列 三维点云 深度图像 连通域分析 

分 类 号：TP391[自动化与计算机技术—计算机应用技术]