DC-55 GHz高性能焊球阵列封装用非垂直互连结构  

Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application

作　　者：刘林杰[1,2] 郝跃[1] 周扬帆[3] 王轲 乔志壮 LIU Linjie;HAO Yue;ZHOU Yangfan;WANG Ke;QIAO Zhizhuang(Xidian University,Xi′an 710000,China;The 13th Research Institute of CETC,Shijiazhuang 050000,China)

机构地区：[1]西安电子科技大学,陕西西安710000 [2]中国电子科技集团公司第十三研究所封装专业部,河北石家庄050000 [3]中国电子科技集团公司第十三研究所,河北石家庄050000

出　　处：《光学精密工程》2023年第3期363-370,共8页Optics and Precision Engineering

基　　金：面向紫外探测应用的高性能4H-SiC雪崩光电二极管及探测器阵列基础研究项目(No.61974134)。

摘　　要：根据5G信号对通道带宽的要求,通过研究陶瓷基板中“类同轴”互连的微波特性,设计了一种新型非垂直互连结构,通过陶瓷介电层之间金属化通孔的错位设计,改善垂直过孔与水平传输线转弯处的阻抗突变,更有利于高频信号的传输,进一步扩展带宽。分析了错位角度、阶梯级数、焊球半径和焊球间距对传输性能的影响,设计并实现了宽带低损耗互连陶瓷基板。测试结果表明,该结构的最高应用频率可达55 GHz,在DC-55 GHz频带内插入损耗小于1.5 dB,回波损耗大于15 dB,同时利用实测数据进行信号传输验证,结果表明在未引入预加重、均衡的情况下即可满足56 G/112 G NRZ,112 G PAM4高速信号的传输。The advent of 5G technology has spurred rapid advancements in high-speed signal development,leading to increasing bandwidth requirements for signal channels.This study examines the microwave characteristics of"quasi-coaxial"interconnections in ceramic substrates and proposes a novel non-vertical interconnection structure.By optimizing the design of metallized vias between ceramic layers,the impedance at the junction of vertical vias and horizontal transmission lines is improved,enhancing high-frequency signal transmission and broadening bandwidth.The paper analyzes the effect of misalignment angle,ladder series,solder ball radius,and distance between solder balls on transmission performance.The result is a broadband,low-loss ceramic substrate interconnection.Experimental results show that the structure can operate at 55 GHz with an insertion loss less than 1.5 dB and a return loss greater than 15 dB in the DC-55 GHz band.The measured data demonstrate satisfactory transmission of 56 G/112 G NRZ and 112 G PAM4 high-speed signals without the need for preweighting and equalization.

关 键 词：无线通信 5G 高速 陶瓷基板 类同轴 预加重 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN958.92