高性能不流动半固化片的研究  

Study on high performance non-flowing prepreg

作　　者：李桢林[1,2] 胡彬扬 张雪平 陈文求[1,2] 范和平 Li Zhenlin;Hu Binyang;Zhang Xueping;Chen Wenqiu;Fan Heping(Haiso Technology Co.,Ltd.,Wuhan 430074,Hubei,China;Hubei Research Institute of Chemistry,Jianghan University,Wuhan 430056,Hubei,China)

机构地区：[1]华烁科技股份有限公司 [2]江汉大学湖北省化学研究院

出　　处：《中国胶粘剂》2023年第1期34-38,共5页China Adhesives

基　　金：FPC用耐高温热固胶膜的研究和开发(JDGD-202028)。

摘　　要：选择电子级玻纤布为支撑载体,浸入以耐高温环氧树脂为主体树脂的胶粘剂中,制备出一种综合性能优良的半固化片。通过对所制备的半固化片的粘接强度、回流焊、热应力、介质电阻、介质耐电压、介电常数、溢胶量和热膨胀系数等测试项目进行系统研究。研究结果表明:所制备的高性能不流动半固化片具备优良的性能,能够满足下游客户生产刚挠结合板的需求。A kind of prepreg with excellent comprehensive performance was prepared by selecting electronic grade glass fiber cloth as the support carrier and immersing it in adhesive with high-temperature resistant epoxy resin as the main resin.The bonding strength,reflow soldering,thermal stress,dielectric resistance,dielectric withstand voltage,dielectric constant,adhesive overflowing and coefficient of thermal expansion of the prepared prepreg were systematically studied.The research results showed that the prepared high performance non-flowing prepreg had excellent properties and could meet the demand of downstream customers for the production of rigid-flex PCB.

关 键 词：不流动 半固化片 研究 

分 类 号：TN41[电子电信—微电子学与固体电子学] TQ437[化学工程]