微电子封装材料及其可靠性研究进展  

Research progress in microelectronic packaging materials and their reliability

作　　者：王娟娟 余英丰[1,2] 景华 刘黎成 徐子曦 Wang Juanjuan;Yu Yingfeng;Jing Hua;Liu Licheng;Xu Zixi(State Key Laboratory of Molecular Engineering of Polymers,Department of Macromolecular Science,Fudan University,Shanghai 200433,China;Natong Kernel Co.,Ltd.,Nantong 226007,Jiangsu Province,China;Shanghai Sci-bon Technology Co.,Ltd.,Shanghai 201818,China)

机构地区：[1]聚合物分子工程国家重点实验室,复旦大学高分子科学系,上海200433 [2]南通康尔乐复合材料有限公司,江苏南通226007 [3]上海芯邦新材料科技有限公司,上海201818

出　　处：《中国胶粘剂》2023年第2期25-41,50,共18页China Adhesives

摘　　要：随着微电子产业的发展,各种封装技术不断涌现,对于封装材料的内应力、导热性、电性能都提出了更高的要求。本文介绍了聚合物微电子封装的主要材料,包括环氧树脂、有机硅、聚酰亚胺。由于封装的无铅化发展以及高功率导致的散热需求,导电胶和热界面材料成了在封装中研究的较多热门材料。根据产品的使用环境,通过加速试验(温度循环、高加速应力试验、疲劳试验等)可以评估封装的可靠性。为探索封装失效的原因,需要对产品进行失效分析。本文介绍了常用的失效分析技术,具体描述了倒装芯片的底填胶的失效分析,并根据失效原因对底填材料提出了性能要求。封装材料的冷热冲击和湿热稳定性是影响可靠性的重要因素,湿气会导致封装“爆米花效应”、电化学迁移等后果从而使器件失效。为此,本文探究了湿气对半导体器件的影响及扩散机理,并对影响材料吸水性能的因素(如极性、自由体积、材料微相分离等)进行了综述。最后,还对微电子封装材料的未来发展进行了展望。With the development of microelectronic industry,a variety of packaging technologies are emerging,which put forward higher requirements for the internal stress,thermal conductivity and electrical properties of packaging materials.In this paper,the main materials for polymer microelectronic packaging,including epoxy resin,silicone,and polyimide were introduced.Due to the development of lead-free packaging and the need for heat dissipation of high power,conductive adhesive and thermal interface materials had become the more popular materials in the packaging research.According to the use environment of the product,the reliability of packaging could be evaluated by accelerated test(temperature cycle,high accelerated stress test,fatigue test,etc.).In order to explore the causes of packaging failure,it was necessary to carry out failure analysis for the product.In this paper,the commonly used failure analysis technology was introduced,the failure analysis of the underfill adhesive of flip chip was specifically described,and the performance requirements for the underfill material were put forward according to the failure reasons.The cold/thermal shock and hygrothermal stability of packaging materials were important factors affecting the reliability,moisture could lead to package“popcorn effect”,electrochemical migration and other consequences,which would make the device fail.For this reason,in this paper,the effect and diffusion mechanism of moisture on semiconductor devices were explored,and the factors affecting the water absorption performance of materials(such as polarity,free volume,material micro-phase separation,etc.)were reviewed.Finally,the future development of microelectronic packaging materials was also prospected.

关 键 词：电子封装 导电胶 导热胶 可靠性分析 失效分析 湿热老化 

分 类 号：TQ436[化学工程]