基于MEMS技术的原子气室封装工艺  

Atomic Vapor Cell Packaging Technology Based on MEMS Technology

作　　者：李云超 党峰 辛红强 李璐 杜剑英 LI Yun-chao;DANG Feng;XIN Hong-qiang;LI Lu;DU Jian-ying(Weapon Industry Test and Measuring Academy in China,Huayin 714200,China)

机构地区：[1]中国兵器工业试验测试研究院,陕西华阴714200

出　　处：《仪表技术与传感器》2023年第2期22-26,共5页Instrument Technique and Sensor

基　　金：国防技术基础科研项目(JCKY2016208A006)。

摘　　要：在基于MEMS技术原子气室的制备工艺中,难度较大的是碱金属的填充技术及阳极键合封装工艺,该工艺流程直接影响原子气室的质量。为进一步简化原子气室的制备工艺,设计了“双腔式”原子气室结构,采用先阳极键合,再化学反应的方法实现了原子气室批量化的封装。单个原子气室体积为6 mm×4 mm×2.5 mm,经氦气细检漏气率平均达到5×10^(-8)Pa·m^(3)·s^(-1),通过搭建实验平台,测得了不同温度下的原子气室D1线吸收谱线图,实验结果表明原子气室封装成功。In the fabrication process of the atomic vapor cell based on the MEMS technology,the most difficult thing is the filling of alkali metal and the anodic bonding packaging process,which directly affects the quality of the atomic vapor cell.In order to further simplify the preparation process of the atomic vapor cell,a“dual-cavity”structure was designed.Batch packaging of atomic vapor cell was realized by anodic bonding and then chemical reaction.The volume of a single atomic vapor cell was 6 mm×4 mm×2.5 mm,and the average leakage rate reached 5×10-8 Pa·m 3·s-1 through helium fine detection.By building the experimental platform,the absorption spectra of D1 line of the atomic vapor cell at different temperatures were measured,the test results show that the atomic vapor cell is successfully packaged.

关 键 词：芯片原子钟 原子气室 MEMS 阳极键合 吸收谱线 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]