磁控溅射工艺参数对TiAlN薄膜结构和性能影响规律研究  

Study on Effect Law of Magnetron Sputtering Process Parameters on Microstructure and Properties of TiAlN Films

作　　者：李昌恒 刘奎仁 魏世丞 韩庆 王博 王玉江 LI Chang-heng;LIU Kui-ren;WEI Shi-cheng;HAN Qing;WANG Bo;WANG Yu-jiang(Institute of Metallurgy Engineering,Northeastern University,Shenyang 110819,China;National Key Laboratory for Equipment Remanufacturing,Academy ofArmored Forces Engineering,Beijing 100072,China)

机构地区：[1]东北大学冶金学院,辽宁沈阳110819 [2]陆军装甲兵学院装备再制造技术国防科技重点实验室,北京100072

出　　处：《稀有金属与硬质合金》2023年第1期70-76,85,共8页Rare Metals and Cemented Carbides

基　　金：国家科技重大专项(2017-Ⅶ-0012-0109)。

摘　　要：采用XRD、SEM、纳米压痕仪、纳米划痕仪等分析了磁控溅射工艺参数对TiAlN薄膜物相、微观组织、力学性能及结合力的影响规律。结果表明,所有样品生成相均为面心立方的TiAlN,且在(111)晶面择优生长,薄膜表面形成三棱锥状密排晶粒。选定硬度与结合力两个指标对TiAlN薄膜进行评价,通过正交实验发现,硬度与结合力的最优工艺参数均为基底偏压-100 V,工作气压0.3 Pa,溅射电流8 A,氮流量40 sccm。The effect law of magnetron sputtering process parameters on phase,microstructure,mechanical properties,and adhesion of TiAlN films were analyzed by XRD,SEM,nanoindenter,and nano-scratch tester.The results show that the generated phases of all samples are face-centered cubic TiAlN and preferentially grow on(111)crystal plane.The close-packed triangular pyramid-like grains are formed on the surface of the films.By selecting hardness and adhesion to evaluate the TiAlN films,it is found that the optimal process parameters of hardness and adhesion are substrate bias voltage of-100 V,working air pressure of 0.3 Pa,sputtering current of 8 A,and nitrogen flow of 40 sccm through orthogonal experiments.

关 键 词：TIALN薄膜 磁控溅射 工艺参数 正交实验 硬度 结合力 

分 类 号：TG174.4[金属学及工艺—金属表面处理]