高密度CCGA热疲劳仿真及可靠性分析  

Thermal Fatigue Simulation and Reliability Analysis of High Density CCGA

作　　者：王小强[1,2] 李斌[1] 邓传锦[2] †陈思[2] 王斌 苏伟 WANG Xiaoqiang;LI Bin;DENG Chuanjin;CHEN Si;WANG Bin;SU Wei(School of Electronic and Information Engineering,South China University of Technology,Guangzhou 510640,Guangdong,China;The Fifth Electronics Research Institute of the Ministry of Industry and Information Technology,Guangzhou 511370,Guangdong,China)

机构地区：[1]华南理工大学电子与信息学院,广东广州510640 [2]工业和信息化部电子第五研究所,广东广州511370

出　　处：《华南理工大学学报（自然科学版）》2023年第3期98-109,共12页Journal of South China University of Technology(Natural Science Edition)

基　　金：广东省科技厅重点研发计划项目(2020B0404030005)。

摘　　要：陶瓷柱栅阵列(CCGA)封装具有优良的电热性能和高密度的信号互连特点,是航空航天等高可靠应用领域的首选。当引脚超过1000以上时,由于封装形式及材料本身特性,高密度CCGA在温度变化环境中更容易出现失效。针对CCGA1144结构开展温度循环试验,通过微观结构观察和有限元仿真,研究在-55~125℃温度循环条件下,焊柱应力分布、变化规律、失效原因及模式。结果表明,温度循环过程中外圈焊柱与内圈焊柱相比,等效形变、等效应力、等效应变及塑性应变变化范围更大,更容易发生失效,特别是外圈的边缘焊柱。研究给出了热疲劳试验过程中焊柱的薄弱点,指出0.15~0.60 mm及2.17~2.43 mm两个区间是焊柱发生裂纹和断裂失效的危险区域,且后者区间更易产生裂纹及断裂。提出了焊柱热疲劳的3种失效模式,指出焊柱在疲劳机制、蠕变机制共同作用下产生损伤或失效,给出了加固和优化设计方向的建议。研究结果对高密度CCGA的质量改进提升、发展和应用具有指导意义和参考价值。With the characteristics of excellent electrothermal performance and high-density signal interconnec⁃tion,ceramic column grid array(CCGA)packaging is the first choice in highly reliable applications such as aero⁃space.When the pin exceeds 1000,due to the packaging form and the characteristics of the material itself,highdensity CCGA is more likely to fail in the environment of temperature change.The paper carried out temperature cycling test for CCGA1144 structure,and studied the stress distribution,variation law,failure cause and mode of welding column through microstructure observation and finite element simulation under the temperature cycling con⁃dition of-55~125℃.The results show that the variation range of total deformation,equivalent stress,equivalent elastic strain and plastic strain of outer ring welding column is larger than that of inner ring welding column in the process of temperature cycle,and it is more prone to failure,especially the edge welding column of outer ring.The paper identified the weakness of welding column in the thermal fatigue test and pointed out that the two sections of 0.15~0.60 mm and 2.17~2.43 mm are the dangerous areas of crack and fracture failure,and the latter section is more prone to crack and fracture.It put forward three failure modes of thermal fatigue of welding column,and pointed out that the welding column was damaged under the joint action of fatigue mechanism and creep mecha⁃nism.Suggestions on the direction of reinforcement and optimization design were given.The research results have guiding significance and reference value for the quality improvement,development and application of high-density CCGA.

关 键 词：陶瓷柱栅阵列 热疲劳 有限元 温度循环 失效 

分 类 号：TN47[电子电信—微电子学与固体电子学]