双还原剂SHP和DMAB对ABS表面化学镀铜的影响  

Effect of double reducing agents of SHP and DMAB upon electroless copper plating of ABS surface

作　　者：宋晅 符冬琴 陈怀军[1] 朱皓 程熠 赵文霞[1] 刘欣 回凯宏 李鑫巍 赵伟 Song Xuan;Fu Dongqin;Chen Huaijun;Zhu Hao;Cheng Yi;Zhao Wenxia;Liu Xin;Hui Kaihong;Li Xinwei;Zhao Wei(College of Chemistry and Chemical Engineering,Ningxia Normal University,Guyuan 756000,China;School of International Trade,Hainan College of Economics and Business,Haikou 571127,China)

机构地区：[1]宁夏师范学院化学化工学院,宁夏固原756000 [2]海南经贸职业技术学院国际贸易学院,海南海口571127

出　　处：《电镀与精饰》2023年第5期18-25,共8页Plating & Finishing

基　　金：宁夏自然科学基金(2022AAC03298、2020AAC03266);六盘山资源工程技术研究中心(HGZD-18);宁夏高等学校一流学科建设(教育学学科)(NXYLXK2017B11)资助。

摘　　要：为进一步改善以次磷酸盐作为还原剂的化学镀铜溶液的沉积速率,采用次磷酸钠(SHP)和二甲胺基甲硼烷(DMAB)构成双还原剂用于化学镀铜溶液中,研究了两种还原剂复合添加浓度对聚丙烯腈-丁二烯-苯乙烯共聚物(ABS)表面化学镀铜的影响。利用网格设计法,探讨化学镀铜溶液中两种还原剂复合的适宜浓度配比,通过恒温加热测试,研究两种还原剂的复合添加浓度对化学镀铜溶液稳定性的影响,并采用场发射扫描电子显微镜和X射线能谱分析仪对化学镀铜层的微观形貌和组成进行表征。研究结果表明,在DMAB和SHP的添加浓度分别为0.50 g·L^(-1)和90 g·L^(-1)时,DMAB和SHP具有良好的协同作用,此时化学镀铜溶液的稳定性好,化学镀铜的沉积速率最大,为3.14μm·h^(-1)。化学镀铜层表面铜晶粒排列致密,表面平整,且镀层中铜含量达到97.4%,ABS表面与化学镀铜层之间的粘结强度最高,达到0.95 kN·m^(-1)。In this experiment,sodium hypophosphite(SHP)and borane dimethylamine complex(DMAB)were used to form double reducing agents in the electroless copper plating solution in order to further improve the deposition rate of electroless copper plating solution with hypophosphite as single reducing agent.Effects of the additive concentration of double reducing agents upon the electroless copper plating of acrylonitrile-butadiene-styrene(ABS)were investigated.The optimum concentration ratio of double reducing agents in the electroless copper plating was explored by grid design method,and the influence of concentration of double reducing agents on the stability of electroless copper plating solution was studied through continuous constant temperature heating test.In addition,the microstructure and composition of electroless copper plating layer were characterized by field emission scanning electron microscopy and X-ray energy spectrum analyzer,respectively.The results indicated that the stability of electroless copper plating solution was good when the concentrations of DMAB and SHP were 0.50 g·L^(-1)and 90 g·L^(-1),respectively.Under the above conditions,DMAB and SHP had a good synergistic effect,the deposition rate of electroless copper plating was the highest of 3.14μm·h^(-1).The copper crystalline grains of electroless copper plating were compact and the surface was smooth,and the copper content in electroless copper plating layer reached 97.4%.At the same time,the adhesion strength between ABS substrate and the electroless copper player reached the highest of 0.95 kN·m^(-1).

关 键 词：化学镀铜 次磷酸钠 二甲胺基甲硼烷 沉积速率 粘结强度 

分 类 号：TQ153.1[化学工程—电化学工业]