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作 者:韩兆芳[1] 俞晓勇 HAN Zhaofang;YU Xiaoyong(The 58th Research Institute of CETC,Wuxi 214035,China)
机构地区:[1]中国电子科技集团公司第五十八研究所,江苏无锡214035
出 处:《电子质量》2023年第3期44-47,共4页Electronics Quality
摘 要:寿命试验常被用来评估集成电路等半导体器件的可靠性,为了节约试验时间,常采用加速寿命试验方法去评估集成电路产品的工作寿命。采用基于可靠性手册中器件失效率历史数据和基于失效物理模型两种方法对接口混合集成电路的长期工作寿命进行了预计及验证。首先,通过接口混合集成电路产品多批次寿命可靠性试验的历史数据计算出了电路工作寿命;然后,基于可靠性手册中器件失效率的历史数据、模型及其使用特性要素计算出产品的工作寿命。结果表明,两者较为接近;从而证明该类混合集成电路在加速寿命试验数据不够的情况下,采用基于可靠性手册中器件失效率数据对其进行寿命预测是可行的,为接口混合集成电路长期工作寿命评估提供了一定的参考。Life test is often used to assess the reliability of integrated circuits and other semiconductor devices.In order to save time,the accelerated life test method is often used to evaluate the working life of the IC products.The long service life of hybrid integrated circuit with interface is prediced and verified by the method based on the historical data of failure rate of device in reliability data and the method based on failure physical model.Firstly,based on the historical data of multi-batch life reliability test of interface hybrid IC products,the working life of the circuit is calculated.Then,the product working life is calculated based on the historical data of failure rate,model and usage characteristics in the reliability manual.The results show that the two are relatively close.It is proved that it is feasible to use the device failure rate in reliability manual to predict the life of hybrid integrated circuits when the accelerated life test data is insufficient,which provides certain reference for the evaluation of long-term service life of hybrid inteqrated circuits.
分 类 号:TN453[电子电信—微电子学与固体电子学]
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