亚硫酸无氰镀金技术在电子互连中的应用研究  

Application of sulfite cyanide-free gold plating in highdensity gold interconnects

作　　者：王翀 向静 林亚宁 洪延 周国云 张鸿志 张博 WANG Chong;XIANG Jing;LIN Yaning;HONG Yan;ZHOU Guoyun;ZHANG Hongzhi;ZHANG Bo(School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,Sichuan,China;School of Electronic Information and Electrical Engineering,Chongqing University of Arts and Science,Chongqing 402160,China;Southwest Institute of Applied Magnetism,Mianyang 621000,Sichuan,China)

机构地区：[1]电子科技大学材料与能源学院,四川成都610054 [2]重庆文理学院电子信息与电气工程学院,重庆402160 [3]西南应用磁学研究所,四川绵阳621000

出　　处：《印制电路信息》2023年第5期51-54,共4页Printed Circuit Information

摘　　要：针对电子互连技术中对电镀金层的要求,以亚硫酸盐作为主络合剂的无氰镀金技术为研究对象,研究无氰电镀液电化学性能、均匀能力和电沉积金层表面形貌。通过电化学分析方法获得镀金液的电导率、扩散系数和塔菲尔伏安关系,分析电镀中主要控制参数的设定范围;通过电子扫描显微镜、X射线衍射和X射线能谱分析,获得电沉积金层表面形貌、晶面取向和金层均匀性。结果表明:以亚硫酸盐作为主络合剂的无氰镀金体系能够获得表面平整、均匀性良好的互连金层。Due to the requirements of electroplating gold for electronic interconnects,herein sulfite is involved as the main complexing agent in the cyanide-free gold plating bath,the electrochemical performance of the bath,uniformity ability and surface morphology of the electrodeposited gold layer are explored.Firsltly,the conductivity,diffusion coefficient and Tafel voltametry curve of the gold plating bath has been analysised via electrochemical measurements.The control range of the main parameters in the electroplating has been discussed.The surface morphology,crystal plane orientation and uniformity of the electrodeposited gold layer were obtained through scanning electron microscopy,X-ray diffraction and X-ray energy spectroscopy.The results show that the flat surface and good uniformity gold layer which is seficient for interconnect has been achieved from he sulfite base cyanide-free.

关 键 词：图形电镀 亚硫酸盐镀金 高密度互连 电镀软金 

分 类 号：TN41[电子电信—微电子学与固体电子学] TQ153.1[化学工程—电化学工业]