红外热像法发射率校正及电学法温度补偿方法  

Emissivity Correction by Infrared Thermal Imaging and Temperature Compensation by Electrical Method

作　　者：吕贤亮[1] 王义才 李旭 孙淼 LYU Xianliang;WANG Yicai;LI Xu;SUN Miao(China Electronics Standardization Institute,Beijing 100176,China)

机构地区：[1]中国电子技术标准化研究院,北京100176

出　　处：《电子工艺技术》2023年第3期25-27,共3页Electronics Process Technology

摘　　要：主要对提升半导体分立器件红外热像法结温测量精度,及其与电学法温度补偿技术进行研究,从而实现电学法与红外热像法两者在结温方面的互通性。根据器件材料在不同温度下有不同发射率的理论基础,结合试验研究器件高结温发射率校正技术提升红外热像法结温测试精度,在此基础上理论与试验分析红外热像法与电学法的温度补偿方法,实现只进行红外热像法与电学法中的一种方法就可获得另一种方法的结温。The main researches is on improving the junction temperature measurement accuracy of the infrared thermal imaging method for semiconductor discrete devices and its temperature compensation technology with the electrical method,so as to realize the interoperability of the electrical method and the infrared thermal imaging method in junction temperature.According to the theoretical basis that the device materials have different emissivity at different temperatures,combined with experimental analysis,the high junction temperature emissivity correction technology of devices is studied to improve the junction temperature measurement accuracy of infrared thermal imaging method.On this basis,the temperature compensation methods of infrared thermal imaging method and electrical method are analyzed theoretically and experimentally,and the junction temperature of the other method can be obtained only by one method between infrared thermal imaging method and electrical method.

关 键 词：半导体分立器件 红外热像法 电学法 发射率 结温 

分 类 号：TN304.07[电子电信—物理电子学]