氟硅凝胶对陶瓷封装隔离器漏电流的影响  

Influence of Fluorosilicone Gel on Ceramic Package Isolator Leakage Current

作　　者：高成[1] 李凯 黄姣英[1] 刘宇盟 Gao Cheng;Li Kai;Huang Jiaoying;Liu Yumeng(School of Reliability and Systems Engineering,Beihang University,Beijing 100191,China)

机构地区：[1]北京航空航天大学可靠性与系统工程学院,北京100191

出　　处：《半导体技术》2023年第5期448-452,共5页Semiconductor Technology

摘　　要：陶瓷封装隔离器具有高可靠性,灌胶可加强其绝缘性能,但还需要考虑灌胶对隔离器漏电流的影响。以GL3200C型陶瓷封装隔离器为研究对象,研究了氟硅凝胶通过内部水汽对陶瓷封装隔离器漏电流的影响,对隔离器在不同温度下进行稳定性烘焙10 h后测量其内部水汽含量,并分析内部水汽含量对隔离器漏电流的影响。结果表明,在不超过150℃的条件下,氟硅凝胶会分解产生烃类物质并释放至GL3200C封装内,但并不释放水汽,灌胶不会影响陶瓷封装隔离器的漏电流指标,满足隔离器的可靠性要求,但是存在稳定性不足和引入腐蚀性离子的风险。研究结果为工程应用上灌胶的选择提供了参考。Ceramic package isolator has the advantage of high reliability.In order to improve the insulation property,the pouring sealant is applied to the ceramic package isolator.But the influence of pouring sealant on the leakage current of the isolator is necessary to be considered.Taking GL3200C ceramic package isolator as the research object,the influence of fluorosilicone gel on leakage current of ceramic package isolator through internal moisture was researched.The internal moisture content of isolators was measured after 10 h of stability baking at different temperatures.The influence of internal moisture content on leakage current of isolators was analyzed.Results show that fluorosilicone gel decomposition produces hydrocarbons and releases them into GL3200C package,but does not release moisture at the temperature lower than 150 C.Pouring sealant does not affect the leakage current of ceramic package isolators,and can meet the reliability requirement of isolators.However,there is a risk of insufficient stability and the introduction of corrosive ions.The research results can provide reference for the selection of pouring sealant in engineering application.

关 键 词：氟硅凝胶 陶瓷封装隔离器 漏电流 内部水汽含量 腐蚀 

分 类 号：TN453[电子电信—微电子学与固体电子学] TN406