P、Ga元素对SnCu0.7无铅焊料抗氧化性的影响  

Effect of P and Ga on Oxidation Resistance of SnCu0.7 Lead-Free Solder

作　　者：贾元伟 梁华鑫 唐芸生 张家涛 普友福 JIA Yuanwei;LIANG Huaxin;TANG Yunsheng;ZHANG Jiatao;PU Youfu(Yunnan Tin Industry Group(Holding)Co.,Ltd.R&D Center,Kunming 650032,China;School of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China)

机构地区：[1]云南锡业集团(控股)有限责任公司研发中心,云南昆明650032 [2]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《热加工工艺》2023年第7期51-55,61,共6页Hot Working Technology

摘　　要：通过静态和动态氧化实验研究了P、Ga元素对SnCu0.7无铅焊料抗氧化性的影响。利用X射线衍射仪(XRD)、扫描电镜(SEM)及能谱仪(EDS)研究了氧化渣中的物相及元素分布。静态氧化实验表明:P能有效提高SnCu 0.7在270℃的抗氧化性,且随着P含量的增加,合金氧化渣量先减少后增加,P含量为10-4时氧化渣量最小;而添加Ga后焊料在270℃和400℃都具有良好的抗氧化性。动态氧化实验表明:P、Ga元素会在氧化渣中富集;添加P可以显著提高SnCu0.7的动态抗氧化行为,而添加Ga后产生粘渣降低了动态抗氧化性;P与Ga共同加入时,可形成Ga-P复杂氧化物存在于氧化渣中,从而抑制Ga的活性使焊料不产生粘渣;添加Ga能够提高SnCu0.7-100P的抗氧化温度,但是会加速P的消耗速率,从而降低合金的抗氧化时间。The effects of P and Ga elements on the oxidation resistance of SnCu0.7 Pb-free solder were studied through static and dynamic oxidation experiments.X-ray diffractometer(XRD),scanning electron microscope(SEM)and energy dispersive spectrometer(EDS)were used to study the phase and element distribution of the oxide slag.The static oxidation experiment shows that P can effectively improve the oxidation resistance of SnCu0.7 at 270℃and with the increase of P content,the amount of alloy oxide slag decreases first and then increases.When the P content is 10-4,the amount of oxide slag is the smallest.After adding Ga,the solder has good oxidation resistance at 270℃and 400℃.The dynamic oxidation experiment shows that:P and Ga elements can be enriched in the oxide slag;adding P can significantly improve the dynamic oxidation resistance of SnCu0.7,while the addition of Ga produces sticky slag and reduces the dynamic oxidation resistance;when P and Ga are added together,Ga-P complex oxides are formed in the oxide slag,which inhibits the activity of Ga so that the solder does not produce sticky slag;adding Ga can increase the oxidation resistance temperature of SnCu0.7-100P,but it will accelerate the consumption rate of P,thereby reducing the oxidation resistance time of the alloy.

关 键 词：P GA SnCu0.7 无铅焊料 抗氧化性 

分 类 号：TG425.1[金属学及工艺—焊接]