DBC铜线键合工艺参数研究  

Study on Bonding Parameters of Copper Wire on DBC Substrate

作　　者：王小钰 张茹 李海新 WANG Xiaoyu;ZHANG Ru;LI Haixin(Yantai Taixin Electronics Technology Co.,Ltd.,Yantai 260046,China;Harbin Engineering University Yantai Research Institute,Yantai 264000,China)

机构地区：[1]烟台台芯电子科技有限公司,山东烟台260046 [2]哈尔滨工程大学烟台研究院,山东烟台264000

出　　处：《电子与封装》2023年第6期27-33,共7页Electronics & Packaging

摘　　要：铜线作为最有发展潜力的新一代键合材料,与铝线相比,具有优异的导电及导热能力。因绝缘栅双极型晶体管(IGBT)需承载大电流,采用铜线可在键合线数量不变的基础上提高电流传输能力和散热能力。采用铜线超声楔形键合对覆铜陶瓷基板(DBC)第一键合点和第二键合点的键合工艺参数进行研究,以剪切力作为衡量键合质量的标准,采用单因素分析法研究各参数对键合点强度的影响,采用正交试验确定最佳工艺参数,为铜线键合工艺的参数设定提供参考及指导方法。Copper wire as the most promising new generation bonding material has excellent electrical and thermal conductivity compared with aluminum wire.Because insulated gate bipolar transistors(IGBTs)need to carry large current,copper wire can be used to improve current transmission capacity and heat dissipation capacity while maintaining the same number of bonding wires.The bonding process parameters of the first and second bonding points of DBC substrate are studied by using copper wire ultrasonic wedge bonding.The shear force is used as the standard to measure the bonding quality,and the single factor analysis method is used to study the influence of each parameter on the bonding strength.The optimum process parameters are determined by orthogonal test.It provides a reference and guidance method for parameter setting of copper wire bonding process.

关 键 词：铜线 超声键合 楔形键合 正交试验 

分 类 号：TM241[一般工业技术—材料科学与工程] TN305.94[电气工程—电工理论与新技术]