陶瓷绝缘子金属封装外壳气密性失效机理分析  

Analysis of Air Tightness Failure Mechanism of Metal Package Shell of Ceramic Insulator

作　　者：胡竹松[1] 张凤伟 宁峰鸣 HU Zhusong;ZHANG Fengwei;NING Fengming(The 43rd Research Institute of CETC,Anhui 230088,China;Hefei Shengda Technology Industry Co.,Ltd.,Anhui 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽230088 [2]合肥圣达科技实业有限公司,安徽230088

出　　处：《集成电路应用》2023年第5期294-296,共3页Application of IC

摘　　要：阐述基于氦质谱检漏仪、SEM、EDX手段,对陶瓷绝缘子表面的镀镍层厚度、钎料量、钎料种类对陶瓷绝缘子与陶瓷银铜钎焊气密性失效机理的分析。研究表明,随着陶瓷绝缘子表面镀镍层厚度增加、钎料采用纯银钎焊,钎焊后的可靠性有上升的趋势。钎料量增加,钎焊后的可靠性有下降的趋势。采用合适的焊种及钎料量可有效地提高产品的可靠性。This paper describes SEM and EDX,the failure mechanism of nickel plating thickness,filler metal amount and filler metal type on the air tightness of ceramic insulator and ceramic silver copper brazing based on helium mass spectrometer leak detector.The research shows that with the increase of the thickness of nickel plating on the surface of ceramic insulators and the use of pure silver brazing filler metal,the reliability after brazing has an upward trend.With the increase of filler metal content,the reliability after brazing has a downward trend.The reliability of products can be effectively improved by using appropriate welding types and filler metals.

关 键 词：电子器件 陶瓷绝缘子 封装外壳 钎焊 气密性 

分 类 号：TN103[电子电信—物理电子学]