活性剂对Sn64Bi35Ag1焊锡膏空洞率影响研究  

Study on Effect of Active Agent on Void Rate of Sn64Bi35Ag1 Solder Paste

作　　者：武信 张欣 熊晓娇 何欢 吕金梅 彭金志 WU Xin;ZHANG Xin;XIONG Xiao-jiao;HE Huan;LYU Jin-mei;PENG Jin-zhi(Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming,Yunnan 650217,China)

机构地区：[1]云南锡业锡材有限公司,云南昆明650217

出　　处：《云南冶金》2023年第3期110-114,共5页Yunnan Metallurgy

摘　　要：通过对活性剂性能研究,探索助焊剂配方体系中不同活性剂类型及含量变化对焊锡膏空洞率的影响。以PCB测试基板为载体,焊锡膏经印刷、回流焊接后,使用XD7500VR JADE EP型号的X-Ray设备进行焊点空洞率测试,以空洞率的大小为评价指标,按照试验设计对6种不同活性剂进行了助焊剂合成,进一步配制焊锡膏进行焊点空洞率测试。经过对比分析,优选取了4种分解温度呈阶梯状的有机酸进行复配试验。结果表明:有机酸的复配能显著改善焊点的空洞率,己二酸、丙二酸、癸二酸、辛二酸的含量分别为2%、2%、4%、3%复配时,焊锡膏空洞率为6.8%。It is studied effect of different types and content change of active agent on void rate of solder paste in flux formation system through performance study of active agent.PCB test board was taken as the carrier,with the process of printing reflux welding of solder paste,the X-ray equipment that type is XD7500VR JADE EP was adopted for solder joint void rate test,the size of void rate was taken as the evaluation indicators,flux synthesis of 6 different active agents were designed as per the tests,and the solder paste was furtherly formulated for solder joint void rate test.Four kinds of organic acid with step-like decomposition temperature were selected as the first choice for compounding test after contrastive analysis.Results show:The compounding of organic acid can obviously improve void rate of solder joint,when compounding is carried out,the content of adipic acid,malonic acid,sebacic acid,spicy acid separately are 2%,2%,4%,3%,the voil rate of solder paste is 6.8%.

关 键 词：低温焊锡膏 活性剂 空洞率 焊点 

分 类 号：TD451[矿业工程—矿山机电]