半导体先进封装光刻机的微振动要求分析  

Analysis of Semiconductor Advanced Packaging Photography Machine

作　　者：荣国辉 程星华 王晶 Rong Guohui;Cheng Xinghua;Wang Jing(China Electronics Engineering Design Institute Co.,Ltd.,Beijing 100097,CHN)

机构地区：[1]中国电子工程设计院有限公司,北京100142

出　　处：《模具制造》2023年第6期202-204,207,共4页Die & Mould Manufacture

摘　　要：先进封装技术将成为集成电路发展的另一个技术方向,来提升整体系统的集成度以及应用方面的整体性能。先进封装技术区别于传统封装技术,主要体现在尺度的变化带来的封装工艺的变化。其中先进封装中最为关键的工艺包括光刻,而防微振技术的应用将能够保证光刻设备在复杂多样的振动环境下正常工作。Advanced packaging technology will become another technical direction of IC,to improve the integration of the overall system and the overall performance of the application.Advanced packaging technology is different from the traditional packaging technology,mainly reflected in the change of packaging process brought about by the change of scale.The most criti-cal process in advanced packaging includes lithography,and the application of antimicrovibration technology will ensure that the lithography equipment works properly in complex and diverse vibration environments.

关 键 词：防微振 光刻机 先进封装 

分 类 号：TN36[电子电信—物理电子学]