柔性端电极多层瓷介电容器失效模式分析与改进措施  

Analysis and improvement measures of failure modes in multi-layer ceramic capacitors with flexible end electrodes

作　　者：薄鹏[1] 曹瑞 徐琴 周丹丹 孟猛[1] BO Peng;CAO Rui;XU Qin;ZHOU Dandan;MENG Meng(China Academy of Technology,Beijing 100098,China;Chengdu Hongke Electronic Technology Co.,Ltd.,Chengdu 610100,China)

机构地区：[1]中国空间技术研究院,北京100098 [2]成都宏科电子科技有限公司,四川成都610100

出　　处：《电子元件与材料》2023年第6期750-756,共7页Electronic Components And Materials

摘　　要：柔性端电极多层陶瓷电容器(Flexible Termination Multilayer Ceramic Capacitors,FTMLCCs)在典型三层端电极基础上,引入由树脂和导电填充物构成的柔性电极层,在不增加电容尺寸或削减容量的前提下,降低瓷体开裂风险。但FTMLCC引入柔性层结构,降低瓷体开裂风险的同时也可能引入新的失效风险。选取两种1812尺寸FTMLCC产品为研究对象,利用扫描电子显微镜、聚焦离子束剖切与三维重构等技术进行了柔性层物理结构和结合界面特性的详细表征。通过装联、抗弯曲与环境试验评价的方法,对柔性电极结构、柔性层相关缺陷和失效模式进行了深入研究。研究表明,柔性端电极虽增强了MLCC抗弯性,但柔性层内空洞或弱层间结合力可能诱发电极内开裂或界面剥离等新失效模式,造成容量下降。因此,生产或使用FTMLCC产品时,需提升柔性层耐焊性,控制装联条件,并适当除湿,以保护瓷体,提升其装联可靠性。Flexible Termination Multilayer Ceramic Capacitors(FTMLCCs)introduce a flexible electrode layer composed of resin and conductive filler based on the typical three-layer electrode,reducing the risk of ceramic cracking without increasing the size of the capacitor or reducing its capacity.However,while FTMLCC's flexible layer structure mitigates ceramic cracking risks,it may also introduce new failure risks.Two types of 1812 size FTMLCC products were selected for study.Detailed characterization of the physical structure of the flexible layer and the bonding interface characteristics was conducted using scanning electron microscopy,focused ion beam sectioning,and three-dimensional reconstruction techniques.The flexible electrode structure,related defects in the flexible layer,and failure modes were extensively studied through methods of solder joint,anti-bending,and environmental testing.The study shows that while the flexible termination enhances the anti-bending ability of MLCC,internal voids or weak interlayer bonding forces in the flexible layer may induce new failure modes such as internal cracking or interface peeling in the electrode,leading to a decrease in capacity.Therefore,when manufacturing or using FTMLCC products,it is necessary to enhance the solderability of the flexible layer,control soldering conditions,and properly dehumidify to protect the ceramic body and improve its solder joint reliability.

关 键 词：多层瓷介电容器 柔性端电极 抗弯曲应力 失效分析 装联可靠性 

分 类 号：TM534.1[电气工程—电器]