星载射频组件一体化焊接工艺研究  

Research on Integrative Soldering Process of Spaceborne Radio Frequency Module

作　　者：谢鑫[1] 金大元[1] 万云[1] XIE Xin;JIN Dayuan;WAN Yun(The 36th Research Institute of CETC,Jiaxing 314033,China)

机构地区：[1]中国电子科技集团公司第三十六研究所,浙江嘉兴314033

出　　处：《电子机械工程》2023年第4期50-53,共4页Electro-Mechanical Engineering

摘　　要：基于小型化星载射频组件的研制需求,综合利用微组装工艺与表面安装工艺的技术优点,开发了一种一体化焊接工艺,通过陶瓷封装高铅植球、印制电路板/腔体焊接和低空洞真空汽相焊接,完成了对系统级封装(System in Package,SiP)器件、多层射频板、射频绝缘子、金属腔体和双面安装器件的一体化高可靠焊接。产品性能测试、环境试验及工艺鉴定试验表明,该工艺在生产周期、装配效率、一次合格率、性能一致性、长期可靠性等方面具有突出的优势。Based on the development requirement of miniaturized spaceborne radio frequency(RF)module,an integrative soldering process is presented by comprehensively utilizing the technical advantages of microassembly process and surface mounting technology.Highly reliable integration of system in package(SiP)devices,multi-layer radio frequency board,RF insulators,metal cavity and double side mounting devices is accomplished through ceramic packaging with high lead attached ball,printed circuit board/cavity soldering and low-void vacuum vapor-phase soldering.The product performance test,environmental test and process qualification test show that this process method has outstanding advantages in production cycle,assembly efficiency,first pass rate,performance consistency and long-term reliability.

关 键 词：射频组件 一体化焊接工艺 系统级封装 真空汽相焊接 

分 类 号：TG44[金属学及工艺—焊接]