倒装贴片设备的焊接机构温度误差补偿方法  

Compensation Method for Temperature Error of Soldering Mechanism of Flip Chip Equipment

作　　者：黄云龙 HUANG Yunlong(Dalian Jafeng Automation Co.,Ltd.,Dalian 116041,China)

机构地区：[1]大连佳峰自动化股份有限公司,辽宁大连116041

出　　处：《电子与封装》2023年第8期30-34,共5页Electronics & Packaging

摘　　要：简要介绍了倒装贴片设备的焊接机构和工作过程。分析了焊接机构的机械结构使贴片精度产生较大热误差的机理,并提出了补偿措施。通过Ansys有限元分析软件对焊接机构有效发热点的温度变化状态进行仿真,找到温度关键点。使用无线贴片式热电阻温度传感器检测焊接机构关键点的温度和上照、下照视觉系统的位置偏差,建立神经网络热误差模型。验证结果表明,此方法使倒装贴片设备的x、y方向上的贴片精度偏差在±10μm以内,x方向上的过程能力指数C_(pk)达到1.310,y方向上的C_(pk)达到1.697,满足设备的基本要求。Soldering mechanism and working process of the flip chip equipment are introduced briefly.The mechanical structure of the soldering mechanism is analyzed to produce the mechanism of large thermal error in the placement accuracy,and compensation measures are proposed.Through the Ansys finite element analysis software to simulate the temperature change state of the effective heat generating points of the soldering mechanism,and find the temperature critical points.A wireless patch type thermal resistance temperature sensor is used to detect the temperature of the key points of the soldering mechanism and the position deviations of the upshot and downshot visual system to establish a neural network thermal error model.The verification results indicate that this method ensures the precision deviations of the flip chip equipment are within±10μm in the x and y directions.The process capability index Cpk in the x direction reaches 1.310,and the Cpk in the y direction reaches 1.697,which meets the basic requirements of the equipment.

关 键 词：倒装芯片 焊接机构 精度补偿 热形变 神经网络 

分 类 号：TN305.94[电子电信—物理电子学]