基于钛中间层的玻璃与硅激光键合互联技术  

Laser Bonding and Interconnection between Silicon and Glass Based on Titanium Interlayer

作　　者：王运龙[1] 魏晓旻[1] 刘建军[1] WANG Yunong;WEI Xiaomin;LIU Jianjun(The 38th Research Institute of CETC,Hefei 230031,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,合肥230031

出　　处：《电子工艺技术》2023年第4期13-17,共5页Electronics Process Technology

摘　　要：采用纳秒脉冲式紫外激光实现了含有金属中间层的玻璃与硅激光键合互联。基于激光键合的二维传热模型,通过有限元分析仿真阐述了钛中间层的作用机理。开展了钛中间层薄膜制备及激光键合工艺试验,对比了键合强度,并通过微观形貌和能谱分析,验证了钛中间层在激光键合的有益作用。最终制备了含有6μm中间金属互联层的玻璃-金属-硅键合互联结构。A nanosecond pulsed UV laser has been used to realize the laser bonding and interconnection between glass and silicon with metal interlayer.Based on the two-dimensional heat transfer model of laser bonding,the mechanism of titanium interlayer is described by finite element analysis and simulation.The titanium interlayer is prepared and laser bonding process tests are carried out.The beneficial effect of the titanium interlayer is verified by comparing the bonding strength,the microscopic morphology and energy spectrum analysis.Finally,the glass-metal-silicon bonding structure with 6 μm intermediate metal interconnect layer is prepared.

关 键 词：激光键合 互联 玻璃 中间层 

分 类 号：TN45[电子电信—微电子学与固体电子学]