偶联剂改性对铜箔抗剥强度及PTFE树脂基板性能的影响  

Effect of Coupling Agent Modification on Peel Strength of Copper Foil and Properties of PTFE Resin Substrate

作　　者：武聪[1] 洪颖[1] 郭晓光 WU Cong;HONG Ying;GUO Xiaoguang(Electronics Technology Group Corporation No.46 Research Institute,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《塑料工业》2023年第8期45-49,共5页China Plastics Industry

摘　　要：针对低轮廓铜箔与聚四氟乙烯(PTFE)基板介质层表面结合强度低的问题,采用不同浓度的γ-氨丙基三乙氧基硅烷(KH550)和十七氟癸基三乙氧基硅烷偶联剂对铜箔粗糙表面进行改性处理。通过分析偶联剂对基板的抗剥强度、介质损耗因数tanδ和吸水率的影响,发现当十七氟癸基三乙氧基硅烷浓度为20%时,对铜箔粗糙表面的改性效果最佳,此时基板断面和腐蚀后介质层表面显微形貌显示,铜箔表面与PTFE树脂介质层之间的“锚固现象”最明显,可获得抗剥离强度为1.96 N/mm,介质损耗因数tanδ为0.0015,吸水率为0.042%的基板。Aiming at the problem of low bonding strength between low profile copper foil and polytetrafluoroethylene(PTFE)substrate dielectric layer surface,the rough surface of copper foil was modified withγ-aminopropyltriethoxysilane(KH550)and heptadecafluorodecyl triethoxysilane coupling agents of different concentrations.By analyzing the effects of coupling agents on the peel strength,dielectric loss tanδand water absorption of the substrate,it is found when the concentration of heptadecafluorodecyl triethoxysilane is 20%,the modification effect on the rough surface of copper foil is the best,at the same time,the cross section of the substrate and the micro morphology of the medium layer surface after corrosion shows that the“pinning phenomenon”between the copper foil surface and the PTFE resin layer is the most obvious,and the substrate with a peel strength of 1.96 N/mm,a dielectric loss tanδof 0.0015,and a water absorption of 0.042%could be obtained.

关 键 词：硅烷偶联剂 铜箔 表面 抗剥强度 基板 

分 类 号：TQ325.4[化学工程—合成树脂塑料工业]