集成电路中的引线框架质量影响分析  

Analysis of the Quality Impact of Lead Frame in Integrated Circuits

作　　者：于国军 田教锋 孙天祥 YU Guojun;TIAN Jiaofeng;SUN Tianxiang(Jinchuan Nickel Capital Industrial Co.,Ltd.,Gansu 737100,China)

机构地区：[1]金川镍都实业有限公司,甘肃737100

出　　处：《集成电路应用》2023年第7期41-43,共3页Application of IC

基　　金：甘肃省科技重大专项(18ZD2GC013)。

摘　　要：阐述集成电路中的引线框架质量影响,引线框架的作用及性能要求,引线框架加工工艺,探讨铜基合金的对比,C18150强度和导电率符合引线框架的性能要求。通过蚀刻法、冲压法和轧制作为比较发现,引线框架的制作适用轧制加工。This paper describes the quality impact of lead frames in integrated circuits, the role and performance requirements of lead frames, the processing technology of lead frames, and explores the comparison of copper based alloys. The strength and conductivity of C18150 meet the performance requirements of lead frames. By comparing etching, stamping, and rolling, it was found that the production of lead frames is suitable for rolling processing.

关 键 词：集成电路制造 封装材料 引线框架 铜基合金 

分 类 号：TN407[电子电信—微电子学与固体电子学]