耐热型微胶囊的研究进展  

Progress in the study of heat-resistant microcapsules

作　　者：肖作兵 张斌 寇兴然 牛云蔚 陆欣宇 XIAO Zuobing;ZHANG Bin;KOU Xingran;NIU Yunwei;LU Xinyu(School of Perfume and Aroma Technology,Shanghai Institute of Technology,Shanghai 201418,China)

机构地区：[1]上海应用技术大学香料香精技术与工程学院,上海201418

出　　处：《应用技术学报》2023年第3期242-254,共13页Journal of Technology

基　　金：国家重点研发计划纳米技术专项(2016YFA0200304);国家自然科学基金(21776178);上海市学术带头人计划(21XD1423800)资助。

摘　　要：在高温、高压和机械混合等苛刻的条件下,微胶囊化材料应足够坚固耐久,而这些条件在设计过程中常常被忽略。介绍了几种常见的高温微胶囊,在高温条件下正常工作。指出不同壁材对芯材进行包埋时存在的问题,如两者相容性、芯材的释放方面。重点对复合壁材微胶囊进行介绍,归纳总结了纳米复合材料的耐热机制,并简述了耐热机制的研究手段,归纳可知无机纳米材料的加入会对分子链或其他方面产生影响,从而提高基体材料的耐热性能。指出了目前微胶囊在耐热领域中应用缺陷,并对未来发展进行展望。Microencapsulated materials should be strong enough to withstand harsh conditions such as high temperature,high pressure and mechanical mixing,which were often neglected during the design process.In this review several common high-temperature microcapsules that could work well under high temperature conditions were introduced.Problems of encapsulating the core materials with different shell materials were identified,such as their compatibility and release of core materials.Composite wall microcapsules were introduced in detail,the heat resistance mechanism of nanocomposites was summarized,and the research methods of heat resistance mechanism were described.It can be concluded that the addition of inorganic nanomaterials affected the molecular chain or other aspects,thus improving the heat resistance of matrix materials.The defects of microcapsules in the field of heat resistance application were examined and the future development was prospected.

关 键 词：微胶囊 耐热性 复合壁材 耐热机制 

分 类 号：TB35[一般工业技术—材料科学与工程]